公开(公告)号：US07293994B2

公开(公告)日：2007-11-13

申请号：US11297307

申请日：2005-12-08

申请人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

发明人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US20080282539A1

公开(公告)日：2008-11-20

申请号：US12183288

申请日：2008-07-31

申请人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

发明人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

IPC分类号： H01R43/00

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US07765693B2

公开(公告)日：2010-08-03

申请号：US12183288

申请日：2008-07-31

申请人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

发明人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

IPC分类号： H01R43/00 ,  H05K13/00

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US07944698B2

公开(公告)日：2011-05-17

申请号：US12164367

申请日：2008-06-30

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US20080259572A1

公开(公告)日：2008-10-23

申请号：US12164339

申请日：2008-06-30

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US07486516B2

公开(公告)日：2009-02-03

申请号：US11201972

申请日：2005-08-11

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US20080264603A1

公开(公告)日：2008-10-30

申请号：US12164367

申请日：2008-06-30

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： F28F7/00

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

公开(公告)号：US07606033B2

公开(公告)日：2009-10-20

申请号：US12164339

申请日：2008-06-30

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

公开(公告)号：US06988533B2

公开(公告)日：2006-01-24

申请号：US10607361

申请日：2003-06-26

申请人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

IPC分类号： F28F7/00

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including at least one mounting member directly coupled to the base and for direct attachment to the electronic component so that loading forces for mounting on it the electronic component are not directly applied to the base. The thermally conductive member is a graphite-based material. A compliant force applying mechanism is mounted generally on the base for controlling forces applied on the base.

摘要翻译： 传热装置包括导热构件，其包括具有适于吸收来自电子部件的热量的一个或多个表面的底座和安装组件，该安装组件包括至少一个安装构件，该至少一个安装构件直接连接到基座并用于直接附接到电子部件，因此 用于安装在其上的电子部件的负载力不直接施加到基座。 导热构件是石墨基材料。 柔性力施加机构通常安装在基座上以控制施加在基座上的力。

公开(公告)号：US07071720B2

公开(公告)日：2006-07-04

申请号：US10865253

申请日：2004-06-10

申请人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

IPC分类号： G01R31/02

CPC分类号： H05K7/1061 ,  H05K3/301 ,  H05K3/303

摘要： An apparatus adapted for use in a field replacement unit that is to be coupled to an electronic module. Included in the apparatus are a cover assembly; a biasing assembly disposed within the cover assembly; and, an aligning and coupling mechanism retained in the cover assembly in juxtaposed relation with the biasing assembly for mounting an interposer assembly in a manner, whereby the interposer assembly is generally self-aligned along in-plane axes with respect to the cover assembly for subsequent coupling to an electronic module. A method for use of the apparatus is disclosed.

摘要翻译： 一种适用于要耦合到电子模块的现场更换单元的设备。 装置中包括盖组件; 设置在所述盖组件内的偏置组件; 以及保持在盖组件中的对准和联接机构，其与偏置组件并置关系，用于以一种方式安装插入件组件，由此插入器组件通常相对于盖组件沿面内轴线自对准，用于随后 耦合到电子模块。 公开了一种使用该装置的方法。