利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.023 秒)

    Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
    1.
    发明授权
    Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit 失效
    用于管理用于现场更换单元的焊盘格栅阵列插入件的对准和耦合的方法和装置

    公开(公告)号：US07071720B2

    公开(公告)日：2006-07-04

    申请号：US10865253

    申请日：2004-06-10

    申请人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

    IPC分类号： G01R31/02

    CPC分类号： H05K7/1061 ,  H05K3/301 ,  H05K3/303

    摘要： An apparatus adapted for use in a field replacement unit that is to be coupled to an electronic module. Included in the apparatus are a cover assembly; a biasing assembly disposed within the cover assembly; and, an aligning and coupling mechanism retained in the cover assembly in juxtaposed relation with the biasing assembly for mounting an interposer assembly in a manner, whereby the interposer assembly is generally self-aligned along in-plane axes with respect to the cover assembly for subsequent coupling to an electronic module. A method for use of the apparatus is disclosed.

    摘要翻译： 一种适用于要耦合到电子模块的现场更换单元的设备。 装置中包括盖组件; 设置在所述盖组件内的偏置组件; 以及保持在盖组件中的对准和联接机构，其与偏置组件并置关系，用于以一种方式安装插入件组件，由此插入器组件通常相对于盖组件沿面内轴线自对准，用于随后 耦合到电子模块。 公开了一种使用该装置的方法。

    Mounting a heat sink in thermal contact with an electronic component
    2.
    发明授权
    Mounting a heat sink in thermal contact with an electronic component 有权
    安装与电子元件热接触的散热片

    公开(公告)号：US07944698B2

    公开(公告)日：2011-05-17

    申请号：US12164367

    申请日：2008-06-30

    申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

    摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

    Mounting a Heat Sink in Thermal Contact with an Electronic Component
    3.
    发明申请
    Mounting a Heat Sink in Thermal Contact with an Electronic Component 失效
    安装散热器与电子元件热接触

    公开(公告)号：US20080259572A1

    公开(公告)日：2008-10-23

    申请号：US12164339

    申请日：2008-06-30

    申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    IPC分类号： H05K7/20 ,  H05K3/30

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

    摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

    Method and apparatus for mounting a heat transfer apparatus upon an electronic component
    4.
    发明授权
    Method and apparatus for mounting a heat transfer apparatus upon an electronic component 失效
    将传热装置安装在电子部件上的方法和装置

    公开(公告)号：US06988533B2

    公开(公告)日：2006-01-24

    申请号：US10607361

    申请日：2003-06-26

    申请人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

    IPC分类号： F28F7/00

    CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including at least one mounting member directly coupled to the base and for direct attachment to the electronic component so that loading forces for mounting on it the electronic component are not directly applied to the base. The thermally conductive member is a graphite-based material. A compliant force applying mechanism is mounted generally on the base for controlling forces applied on the base.

    摘要翻译： 传热装置包括导热构件，其包括具有适于吸收来自电子部件的热量的一个或多个表面的底座和安装组件，该安装组件包括至少一个安装构件，该至少一个安装构件直接连接到基座并用于直接附接到电子部件，因此 用于安装在其上的电子部件的负载力不直接施加到基座。 导热构件是石墨基材料。 柔性力施加机构通常安装在基座上以控制施加在基座上的力。

    Apparatus, system, and method of determining loading characteristics on an integrated circuit module
    6.
    发明授权
    Apparatus, system, and method of determining loading characteristics on an integrated circuit module 失效
    确定集成电路模块上负载特性的装置，系统和方法

    公开(公告)号：US06792375B2

    公开(公告)日：2004-09-14

    申请号：US10286193

    申请日：2002-11-01

    申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

    IPC分类号： G06F1900

    CPC分类号： G01M5/005 ,  G01R31/046

    摘要： A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.

    摘要翻译： 一种便携式测试装置，其可与用于在耦合到电路板的集成电路组件上测试负载特性的施力装置一起操作。 包括具有尺寸和形状以模拟待测试的集成电路组件的壳体组件; 联接成用于相对于壳体组件移动的加载元件，可与负载检测系统接合，用于响应于施加力的力施加的力而向其传递力; 将外壳组件与电路板配合的插入器; 以及负载检测系统，其与壳体组件相关联，用于提供表示由施力装置施加到其上的负载力的特性的信号，由此可以确定施力装置的负载传递特性。 还提供了一种测试方法。

    Heat pipe heat sink assembly for cooling semiconductor chips
    8.
    发明授权
    Heat pipe heat sink assembly for cooling semiconductor chips 失效
    用于冷却半导体芯片的热管散热器组件

    公开(公告)号：US06385044B1

    公开(公告)日：2002-05-07

    申请号：US09917446

    申请日：2001-07-27

    申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

    IPC分类号： H05K720

    CPC分类号： H01L23/427 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.

    摘要翻译： 公开了一种为安装在模块上的半导体芯片提供热管冷却的装置和方法。 每个芯片都设有自己的热管用于冷却。 每个热管的端部上的活塞以预定的力加载到每个芯片上，而不需要计数螺杆的转数或使用扭矩测量工具。 每个热管将热量从其被加载的芯片上吸走，将热量传递到散热器以耗散到环境中。 一个大的多芯片模块可以被加载到具有均匀的插入器负载的焊盘栅格阵列插入器上。 该插入器负载独立于热管对芯片的负载而完成。

    Mounting a heat sink in thermal contact with an electronic component
    9.
    发明授权
    Mounting a heat sink in thermal contact with an electronic component 有权
    安装与电子元件热接触的散热片

    公开(公告)号：US07486516B2

    公开(公告)日：2009-02-03

    申请号：US11201972

    申请日：2005-08-11

    申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

    摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。