摘要:
A method of monitoring a microelectronic manufacturing process includes the implementation of a monitoring sensor that is configured to operate in an inter-process mode. During an inter-process mode, a first valve is opened in order to initiate transfer of a processing substrate between at least one processing chamber and a transfer chamber. The monitoring sensor is programmed to monitor the interior of the at least one processing chamber only after the first valve is opened.
摘要:
A method of monitoring a microelectronic manufacturing process includes the implementation of a process monitor that is configured to operate in an inter-process mode.
摘要:
In one aspect of the present invention, a wall assembly may be used to divide the area of a particular living space. The wall assembly may comprise a first and second panel. The first panel may reside within an internal cavity of the second panel. The first panel may also extend beyond the second panel such that both panels may collectively form a wall. A cable may connect the wall assembly to an overhead structure such that it may pull the wall into a storage space of the overhead structure.
摘要:
A high-performance miniature RF sensor that maintains gain, directivity, and isolation in a miniature package. The miniature RF sensor includes stacked current and voltage pickups disposed in a PCB construction, the sensor further including quarter wave transforming filter, triaxial shielding, and skin-effect filtering.
摘要:
In one aspect of the present invention, a wall assembly may be used to divide the area of a particular living space. The wall assembly may comprise a first and second panel. The first panel may reside within an internal cavity of the second panel. The first panel may also extend beyond the second panel such that both panels may collectively form a wall. A cable may connect the wall assembly to an overhead structure such that it may pull the wall into a storage space of the overhead structure.
摘要:
A high-performance miniature RF sensor that maintains gain, directivity, and isolation in a miniature package. The miniature RF sensor includes stacked current and voltage pickups disposed in a PCB construction, the sensor further including quarter wave transforming filter, triaxial shielding, and skin-effect filtering.