Inter-process sensing of wafer outcome
    2.
    发明授权
    Inter-process sensing of wafer outcome 有权
    晶圆结果的过程间感测

    公开(公告)号:US07257494B2

    公开(公告)日:2007-08-14

    申请号:US11126471

    申请日:2005-05-11

    IPC分类号: G06F19/00 G01L21/66

    CPC分类号: H01L21/67253

    摘要: A method of monitoring a microelectronic manufacturing process includes the implementation of a monitoring sensor that is configured to operate in an inter-process mode. During an inter-process mode, a first valve is opened in order to initiate transfer of a processing substrate between at least one processing chamber and a transfer chamber. The monitoring sensor is programmed to monitor the interior of the at least one processing chamber only after the first valve is opened.

    摘要翻译: 监测微电子制造过程的方法包括实施监控传感器,其被配置为在处理间模式下操作。 在处理间模式期间,打开第一阀以启动处理基板在至少一个处理室和转移室之间的转移。 监控传感器被编程为仅在第一阀打开之后监视至少一个处理室的内部。