公开(公告)号：US11109486B2

公开(公告)日：2021-08-31

申请号：US16658515

申请日：2019-10-21

Applicant: Wisconsin Alumni Research Foundation

Inventor： Zhenqiang Ma ,  Guoxuan Qin ,  Namki Cho

IPC: H05K1/00 ,  H05K7/06 ,  H01L21/762 ,  H01L21/764 ,  H01L23/538 ,  H05K1/18 ,  H05K3/28 ,  H01L21/683

Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.

公开(公告)号：US20200084891A1

公开(公告)日：2020-03-12

申请号：US16658515

申请日：2019-10-21

Applicant: Wisconsin Alumni Research Foundation

Inventor： Zhenqiang Ma ,  Guoxuan Qin ,  Namki Cho

IPC: H05K1/18 ,  H05K3/28 ,  H01L21/683

Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.

公开(公告)号：US20130229776A1

公开(公告)日：2013-09-05

申请号：US13724051

申请日：2012-12-21

Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION

Inventor： Zhenqiang Ma ,  Guoxuan Qin ,  Namki Cho

IPC: H05K1/18 ,  H05K3/28

CPC classification number: H05K1/189 ,  H01L21/6835 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68381 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2203/308

Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.

Abstract translation: 本发明提供了具有包括两个或多个电子部件的多电子电子设备结构的诸如集成电路的柔性装置。 结构内的电子部件通过具有多个互连级别的互连结构电连接。 除了多电子电子设备结构之外，柔性器件还包括布置在互连级别周围的弹性材料，包括在互连级之间的空间内。