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1.发明授权Method for characterizing and simulating a chemical mechanical polishing process 失效表征和模拟化学机械抛光工艺的方法公开(公告)号：US06965809B2
公开(公告)日：2005-11-15
申请号：US10609464
申请日：2003-06-27
IPC分类号： B24B37/04 , B24B51/00 , H01L21/304 , G06F19/00
CPC分类号： B24B51/00 , B24B37/042
摘要： A method for characterizing and simulating a CMP process, in which a substrate to be polished, in particular a semiconductor wafer, is pressed onto a polishing cloth and is rotated relative to the latter for a defined polishing time. The method includes defining a set of process parameters, in particular a compressive force and a relative rotational speed between a substrate and polishing cloth; preparing and characterizing a test substrate having test patterns with different structure densities using the defined process parameters; determining a set of model parameters for simulating the CMP process from results of the characterization of the test substrate; determining layout parameters of the substrate which is to be polished; defining a profile of demands for a CMP process result for the substrate to be polished; and simulating the CMP process in order to determine the polishing time required to satisfy the profile of demands.
摘要翻译： 用于表征和模拟CMP工艺的方法，其中要抛光的衬底，特别是半导体晶片被压在抛光布上，并相对于抛光布在相应的抛光时间内旋转。 该方法包括定义一组工艺参数，特别是限定衬底和抛光布之间的压缩力和相对转动速度; 使用所定义的工艺参数来制备和表征具有不同结构密度的测试图案的测试基板; 从测试基板的表征结果确定一组用于模拟CMP工艺的模型参数; 确定待抛光的衬底的布局参数; 定义要抛光的基底的CMP工艺结果的要求的轮廓; 并模拟CMP工艺以确定满足需求曲线所需的抛光时间。
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2.发明授权Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers 有权用于加热液体或粘性抛光剂的装置和方法，以及抛光晶片的装置公开(公告)号：US06257955B1
公开(公告)日：2001-07-10
申请号：US09515176
申请日：2000-02-29
申请人： Götz Springer , Wolfgang Diewald , Andre Richter
发明人： Götz Springer , Wolfgang Diewald , Andre Richter
IPC分类号： B24B4900
CPC分类号： B24B37/015 , B24B57/02 , F28D7/024 , F28F9/0132
摘要： An apparatus for polishing wafers includes a polishing table with a heating device. A conduit connects a tank holding a liquid polishing agent to a distributor for feeding the liquid polishing agent to the polishing table. A heat exchanger is disposed along the conduit between the tank and the distributor for heating the liquid polishing agent. The heat exchanger is independent of said heating device. A method for heating a polishing agent is also provided.
摘要翻译： 抛光晶片的装置包括具有加热装置的抛光台。 导管将容纳液体抛光剂的罐连接到分配器，以将液体抛光剂供给到抛光台。 沿着罐和分配器之间的导管设置热交换器以加热液体抛光剂。 热交换器独立于所述加热装置。 还提供了一种加热抛光剂的方法。
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