公开(公告)号：US20130099006A1

公开(公告)日：2013-04-25

申请号：US13534542

申请日：2012-06-27

申请人： Won-bin HONG ,  Alexander GOUDELEV ,  Kwang-hyun BAEK ,  Young-hwan KIM

发明人： Won-bin HONG ,  Alexander GOUDELEV ,  Kwang-hyun BAEK ,  Young-hwan KIM

IPC分类号： G06K19/077

CPC分类号： H01Q1/2283 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/16225 ,  H01L2224/48227

摘要： An antenna-printed circuit board (PCB) package is provided. The antenna-PCB package includes a PCB; an antenna portion formed on an upper surface of the PCB and inside the PCB; and a radio frequency integrated circuit (RFIC) chip bonded to a lower surface of the PCB.

摘要翻译： 提供了天线印刷电路板（PCB）封装。 天线PCB封装包括PCB; 形成在PCB的上表面和PCB内部的天线部分; 和射频集成电路（RFIC）芯片，其结合到PCB的下表面。

公开(公告)号：US20130099389A1

公开(公告)日：2013-04-25

申请号：US13531120

申请日：2012-06-22

申请人： Won-bin HONG ,  Alexander GOUDELEV ,  Kwang-hyun BAEK ,  Young-hwan KIM

发明人： Won-bin HONG ,  Alexander GOUDELEV ,  Kwang-hyun BAEK ,  Young-hwan KIM

IPC分类号： H01L23/48

CPC分类号： H01Q1/2283 ,  H01Q21/0025

摘要： A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.

摘要翻译： 一种多层天线包，包括：射频集成电路（RFIC）接口层，被配置为发送射频（RF）信号; 设置在RFIC界面层上的第一介电层; 共面波导层，其设置在所述第一介电层上并被配置为接收由RFIC层发射的RF信号; 设置在共面波导层上的第二电介质层; 以及天线部，其设置在所述第二电介质层上并且被配置为照射从所述共面波导层发送的信号。