Multilayer-structured bolometer and method of fabricating the same
    1.
    发明授权
    Multilayer-structured bolometer and method of fabricating the same 失效
    多层结构测辐射热计及其制造方法

    公开(公告)号:US07667202B2

    公开(公告)日:2010-02-23

    申请号:US12182456

    申请日:2008-07-30

    IPC分类号: G01J5/20

    CPC分类号: G01J5/20 G01J5/02 G01J5/023

    摘要: Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance.

    摘要翻译: 提供一种多层结构的测辐射热计及其制造方法。 在多层结构的测辐射热计中,支撑传感器结构的主体的支撑臂的数量减少到一个,并且在一个支撑臂上形成两个电极。 因此,传感器结构通过仅一个支撑臂与基板电连接。 根据多层结构的测辐射热计和制造测辐射热计的方法,传感器结构的导热性显着降低,显着提高了对温度的敏感性,还减小了测辐射热计的像素尺寸以获得高分辨率的热图像。 此外,由于具有足够大的红外线吸收层,多层结构的测辐射热计可以具有高的填充因子,因此可以提高红外吸收。

    Microbolometer with improved mechanical stability and method of manufacturing the same
    2.
    发明授权
    Microbolometer with improved mechanical stability and method of manufacturing the same 失效
    具有改善机械稳定性的微热辐射计及其制造方法

    公开(公告)号:US07884328B2

    公开(公告)日:2011-02-08

    申请号:US12181871

    申请日:2008-07-29

    IPC分类号: H01L27/14

    摘要: Provided are a microbolometer having a cantilever structure and a method of manufacturing the same, and more particularly, a microbolometer having a three-dimensional cantilever structure, which is improved from a conventional two-dimensional cantilever structure, and a method of manufacturing the same. The method includes providing a substrate including a read-out integrated circuit and a reflective layer for forming an absorption structure, forming a sacrificial layer on the substrate, forming a cantilever structure having an uneven cross-section in the sacrificial layer, forming a sensor part isolated from the substrate by the cantilever structure, and removing the sacrificial layer.

    摘要翻译: 本发明提供一种具有悬臂结构的微电热计及其制造方法,特别是具有三维悬臂结构的微电热计,其从传统的二维悬臂结构得到改进,及其制造方法。 该方法包括提供包括读出集成电路和用于形成吸收结构的反射层的衬底,在衬底上形成牺牲层,在牺牲层中形成具有不均匀横截面的悬臂结构,形成传感器部分 通过悬臂结构从衬底隔离,并去除牺牲层。

    METHOD FOR DEPOSITING AMORPHOUS SILICON THIN FILM BY CHEMICAL VAPOR DEPOSITION
    4.
    发明申请
    METHOD FOR DEPOSITING AMORPHOUS SILICON THIN FILM BY CHEMICAL VAPOR DEPOSITION 审中-公开
    通过化学蒸气沉积沉积非晶硅薄膜的方法

    公开(公告)号:US20110159669A1

    公开(公告)日:2011-06-30

    申请号:US13058047

    申请日:2009-09-18

    IPC分类号: H01L21/20

    CPC分类号: C23C16/0227 C23C16/24

    摘要: Provided is a method of depositing an amorphous silicon thin film by chemical vapor deposition (CVD) to prevent bubble defect occurring when an amorphous silicon thin film is deposited on a substrate contaminated by air exposure. The deposition method includes cleaning a surface of the contaminated substrate with a reaction gas activated by plasma and depositing an amorphous silicon thin film on the cleaned substrate. Here, a vacuum state is maintained from the substrate cleaning step to the thin film deposition step in order to prevent contamination of the surface of the cleaned substrate by re-exposure to air.

    摘要翻译: 提供了一种通过化学气相沉积(CVD)沉积非晶硅薄膜的方法,以防止当非晶硅薄膜沉积在被空气暴露污染的基底上时发生气泡缺陷。 沉积方法包括用等离子体激活的反应气体清洁污染的基底的表面,并在清洁的基底上沉积非晶硅薄膜。 这里,从基板清洗步骤到薄膜沉积步骤保持真空状态,以便通过再次暴露于空气来防止清洁的基板表面的污染。

    INFRARED SENSOR AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    INFRARED SENSOR AND METHOD OF FABRICATING THE SAME 失效
    红外传感器及其制造方法

    公开(公告)号:US20100155601A1

    公开(公告)日:2010-06-24

    申请号:US12511251

    申请日:2009-07-29

    IPC分类号: H01L27/14 B05D5/12 H01L21/00

    摘要: An infrared sensor and a method of fabricating the same are provided. The sensor includes a substrate including a reflection layer and a plurality of pad electrodes, an interdigitated sensing electrode connected to the pad electrode and formed to be spaced apart from the reflection layer by a predetermined distance and a sensing layer formed on the sensing electrode and having an opening exposing a portion in which an interdigitated region of the sensing electrode connected to one pad region is separated from the sensing electrode connected to the other pad electrode. Therefore, the sensor has an electrode in a very simple constitution, and a sensing layer divided into rectangular blocks, so that current that non-uniformly flows into the electrode can be removed. Accordingly, the sensor in which current of the sensing layer can be uniformly flown, and noise is lowered can be implemented.

    摘要翻译: 提供了一种红外线传感器及其制造方法。 该传感器包括:基板,包括反射层和多个焊盘电极;连接到焊盘电极并形成为与反射层隔开预定距离的叉指感测电极,以及形成在感测电极上的感测层, 连接到一个焊盘区域的感测电极的交错区域与连接到另一个焊盘电极的感测电极分离的部分露出。 因此,传感器具有非常简单的结构的电极和分为矩形块的感测层,从而可以去除不均匀地流入电极的电流。 因此,可以实现感测层的电流可以均匀地流动并且噪声降低的传感器。

    BOLOMETER STRUCTURE, INFRARED DETECTION PIXEL EMPLOYING BOLOMETER STRUCTURE, AND METHOD OF FABRICATING INFRARED DETECTION PIXEL
    6.
    发明申请
    BOLOMETER STRUCTURE, INFRARED DETECTION PIXEL EMPLOYING BOLOMETER STRUCTURE, AND METHOD OF FABRICATING INFRARED DETECTION PIXEL 审中-公开
    透镜结构,使用红外线检测像素的BOLOMETER结构,以及制作红外检测像素的方法

    公开(公告)号:US20100148067A1

    公开(公告)日:2010-06-17

    申请号:US12507372

    申请日:2009-07-22

    IPC分类号: G01J5/00 C23F1/00

    摘要: Provided are a bolometer structure, an infrared detection pixel employing the bolometer structure, and a method of fabricating the infrared detection pixel.The infrared detection pixel includes a substrate including a read-out integrated circuit (ROIC) and on which a reflection layer for reflecting infrared light is stacked, a bolometer structure formed to be spaced apart from the substrate and including a temperature-sensitive resistive layer, a first metal layer formed in a pattern on one surface of the temperature-sensitive resistive layer, a second metal layer formed in a pattern complementary to the pattern of the first metal layer on the other surface of the temperature-sensitive resistive layer in order to complementarily absorb infrared light, and an insulating layer formed between the temperature-sensitive resistive layer and the first metal layer, and a metal pad receiving a change in resistance of the temperature-sensitive resistive layer according to infrared light absorbed by the first metal layer and the second metal layer from the second metal layer, and transferring the change in resistance to the ROIC.Thus, it is possible to improve responsivity, and implement a simple bolometer structure robust against stress. Consequently, process yield can be improved, and the volume, weight, price, etc., of application products can be reduced by reducing the volume of a bolometer structure.

    摘要翻译: 提供了一种测辐射热计结构,采用测辐射热计结构的红外检测像素,以及制造红外检测像素的方法。 红外线检测像素包括:基板,包括读出集成电路(ROIC),层叠用于反射红外光的反射层,形成为与基板间隔开并包括温度敏感电阻层的测辐射热计结构, 在温度敏感电阻层的一个表面上以图案形成的第一金属层,第二金属层,以与第一金属层的图案互补的图案形成在第一金属层的图案上,以在该温度敏感电阻层的另一个表面上,以便 互补吸收红外光,以及形成在所述耐温电阻层和所述第一金属层之间的绝缘层,以及金属焊盘,所述金属焊盘根据由所述第一金属层吸收的红外光接收所述耐温电阻层的电阻变化,以及 来自第二金属层的第二金属层,并且传递对ROIC的电阻变化。 因此,可以提高响应度,并且实现对应力的鲁棒的简单的测辐射热计结构。 因此,可以提高工艺产量,并且可以通过减小测辐射热计结构的体积来减少应用产品的体积,重量,价格等。

    MULTILAYER-STRUCTURED BOLOMETER AND METHOD OF FABRICATING THE SAME
    9.
    发明申请
    MULTILAYER-STRUCTURED BOLOMETER AND METHOD OF FABRICATING THE SAME 失效
    多层结构的玻璃及其制造方法

    公开(公告)号:US20090152467A1

    公开(公告)日:2009-06-18

    申请号:US12182456

    申请日:2008-07-30

    IPC分类号: G01J5/10 H01L21/00

    CPC分类号: G01J5/20 G01J5/02 G01J5/023

    摘要: Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance.

    摘要翻译: 提供一种多层结构的测辐射热计及其制造方法。 在多层结构的测辐射热计中,支撑传感器结构的主体的支撑臂的数量减少到一个,并且在一个支撑臂上形成两个电极。 因此,传感器结构通过仅一个支撑臂与基板电连接。 根据多层结构的测辐射热计和制造测辐射热计的方法,传感器结构的导热性显着降低,显着提高了对温度的敏感性,还减小了测辐射热计的像素尺寸以获得高分辨率的热图像。 此外,由于具有足够大的红外线吸收层,多层结构的测辐射热计可以具有高的填充因子,因此可以提高红外吸收。

    MICROBOLOMETER WITH IMPROVED MECHANICAL STABILITY AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    MICROBOLOMETER WITH IMPROVED MECHANICAL STABILITY AND METHOD OF MANUFACTURING THE SAME 失效
    具有改进的机械稳定性的微型测量仪及其制造方法

    公开(公告)号:US20090152466A1

    公开(公告)日:2009-06-18

    申请号:US12181871

    申请日:2008-07-29

    IPC分类号: H01L27/14

    摘要: Provided are a microbolometer having a cantilever structure and a method of manufacturing the same, and more particularly, a microbolometer having a three-dimensional cantilever structure, which is improved from a conventional two-dimensional cantilever structure, and a method of manufacturing the same. The method includes providing a substrate including a read-out integrated circuit and a reflective layer for forming an absorption structure, forming a sacrificial layer on the substrate, forming a cantilever structure having an uneven cross-section in the sacrificial layer, forming a sensor part isolated from the substrate by the cantilever structure, and removing the sacrificial layer.

    摘要翻译: 本发明提供一种具有悬臂结构的微电热计及其制造方法,特别是具有三维悬臂结构的微电热计,其从传统的二维悬臂结构得到改进,及其制造方法。 该方法包括提供包括读出集成电路和用于形成吸收结构的反射层的衬底,在衬底上形成牺牲层,在牺牲层中形成具有不均匀横截面的悬臂结构,形成传感器部分 通过悬臂结构从衬底隔离,并去除牺牲层。