公开(公告)号：US06181864B2

公开(公告)日：2001-01-30

申请号：US09133370

申请日：1998-08-13

申请人： Woo-Hyuk Jang ,  Byong-Gwon Yoo ,  Hyung-Jae Lee ,  Tae-Hyung Rhee

发明人： Woo-Hyuk Jang ,  Byong-Gwon Yoo ,  Hyung-Jae Lee ,  Tae-Hyung Rhee

IPC分类号： G02B600

CPC分类号： G02B6/3855 ,  G02B6/3833 ,  G02B6/3834

摘要： A fiber array module using soldering, and a fabrication method thereof, in which the method includes the steps of: forming holes into which optical fibers can be inserted, in a silicon wafer substrate or a ceramic substrate at predetermined intervals, forming a metal layer on the walls of the holes and the entire surface of the substrate, to allow walls of the holes and an entire surface of the substrate to be plated with a solder alloy material; plating the walls of the holes and the entire surface of the substrate with the solder alloy material; inserting metal-coated optical fibers into the holes plated with the solder alloy material; positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure; fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring epoxy curable by heat or ultraviolet light thereon, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device, and polishing an end of the optical fiber module formed of optical fibers protruding through the holes, to provide optical luminance. Accordingly, the environmental characteristics and reliability of a device package are improved upon the connection of the optical fibers. Also, the fiber array module is simply manufactured, and the ends of loaded optical fibers are easily polished, thus fabricating an inexpensive connection module. Furthermore, the optical fibers are accurately arrayed by self-alignment using the surface tension of the solder material.

摘要翻译： 一种使用焊接的光纤阵列模块及其制造方法，其中该方法包括以下步骤：以预定间隔在硅晶片衬底或陶瓷衬底中形成可插入光纤的孔，在其上形成金属层 孔的壁和基板的整个表面，以允许孔的壁和基板的整个表面用焊料合金材料镀覆; 用焊料合金材料镀覆孔的壁和基板的整个表面; 将金属涂覆的光纤插入镀有焊料合金材料的孔中; 通过加热所得结构，使用焊料合金材料的表面张力将光纤定位在孔的中心处; 通过在其上通过加热或紫外光浇注可固化的环氧树脂将插入基板的孔中的光纤固定到基板上，以制造能够精确地附着到光波导装置的光纤阵列模块，并抛光 由光纤形成的光纤模块通过孔突出，提供光学亮度。 因此，在光纤的连接时，改善了器件封装的环境特性和可靠性。 而且，简单地制造光纤阵列模块，并且容易抛光加载的光纤的端部，从而制造廉价的连接模块。 此外，通过使用焊料材料的表面张力通过自对准精确地排列光纤。

公开(公告)号：US06298192B1

公开(公告)日：2001-10-02

申请号：US09481519

申请日：2000-01-12

申请人： Byong-Gwon Yoo ,  Hyung-Jae Lee ,  Tae-Hyung Rhee

发明人： Byong-Gwon Yoo ,  Hyung-Jae Lee ,  Tae-Hyung Rhee

IPC分类号： G02B638

CPC分类号： G02B6/30

摘要： Disclosed is an optical waveguide device having a structure capable of allowing the optical waveguide device to be easily connected with an optical fiber array connector while allowing an easy separation thereof from the optical fiber array connector. The optical waveguide device includes an upper substrate and a lower substrate each being provided at a main surface thereof with grooves each extending throughout the substrate in a direction corresponding to a coupling direction of the optical waveguide device to the optical fiber array connector, the upper and lower substrates being bonded to each other in such a fashion that the grooves of the upper substrate face those of the lower substrate, respectively, an optical waveguide portion formed at the main surface of one of the upper and lower substrates within a region defined between the grooves, tubes mounted between the facing grooves of the upper and lower substrates, respectively, each of the tubes having an insertion hole adapted to receive an alignment pin therein, and an adhesive adapted to bond the upper and lower substrates to each other and to bond the tubes to the upper and lower substrates.

摘要翻译： 公开了具有能够使光波导装置容易地与光纤阵列连接器连接的结构的光波导装置，同时容易地与光纤阵列连接器分离。 光波导装置包括上基板和下基板，每个上基板和主基板的主表面上设置有沿着与光波导器件的耦合方向对应于光纤阵列连接器的方向延伸穿过基板的凹槽， 下基板以使得上基板的凹槽分别面对下基板的凹槽的方式彼此接合，形成在上基板和下基板之一的主表面的光波导部分之间的区域内 槽，管，分别安装在上基板和下基板的相对的槽之间，每个管具有适于在其中容纳定位销的插入孔，以及适于将上基板和下基板彼此结合并粘合的粘合剂 管到上下基板。