Abstract:
This invention relates to a method for yield loss analysis of process steps of semiconductor wafers having a plurality of dies, and more particularly relates to a defect inspection technique to determine a hit ratio, computation of yield impact contributions for the defects, and determination of a kill ratio for a specific type of defect. Yield loss is estimated ultimately upon a choice of a defect density distribution function. A defect calibrated factor and a yield impact calibrated factor are introduced herein.
Abstract:
A 3D stereo display method and a device thereof. Two sets of shutters are disposed in a display. The shutters are complementarily interlaced with each other. The opening/closing of the two sets of shutters are controlled by time interval concept. When the display frequency is odd frequency, one set of shutters is activated. When the display frequency is even frequency, the other set of shutters is activated. The two sets of shutters are continuously opened and closed according to the variation of the frequency so that in odd and even frequencies, the left and right eyes can respectively see independent images formed of different subpixels. Therefore, a 3D display effect is presented to bare eyes without reducing resolution.
Abstract:
This invention relates to a method for yield loss analysis of process steps of semiconductor wafers having a plurality of dies, and more particularly relates to a defect inspection technique to determine a hit ratio, computation of yield impact contributions for the defects, and determination of a kill ratio for a specific type of defect. Yield loss is estimated ultimately upon a choice of a defect density distribution function. A defect calibrated factor and a yield impact calibrated factor are introduced herein.