公开(公告)号：US20250054800A1

公开(公告)日：2025-02-13

申请号：US18748763

申请日：2024-06-20

Applicant: X-Celeprint Limited

Inventor： Ruggero Loi

IPC: H01L21/683

Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. At least a portion of each of the sacrificial portions is exposed through an opening. A micro-device is disposed on (e.g., exclusively in direct contact with) each of the sacrificial portions and laterally attached to one of the anchors by a hybrid tether. The hybrid tether comprises an organic tether layer and an inorganic tether layer.

公开(公告)号：US20220328339A1

公开(公告)日：2022-10-13

申请号：US17713814

申请日：2022-04-05

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Ruggero Loi

IPC: H01L21/683 ,  B41M3/00

Abstract: An example of a method of making a heterogeneous semiconductor structure, includes providing a first substrate including a first material; providing a second substrate including a printable processable coupon, wherein the coupon includes a second material different from the first material; and printing the coupon to the first substrate. The method can includes processing the coupon on the first substrate to form an integrated circuit. An example of a heterogeneous structure includes a substrate including a first material and one or more non-native coupons disposed on the substrate, the coupon including a second material different from the first material. The second material can be or comprise an epitaxial material, such as a compound semiconductor material. The first material can be or comprise an elemental semiconductor, such as silicon.

公开(公告)号：US12057340B2

公开(公告)日：2024-08-06

申请号：US17112153

申请日：2020-12-04

Applicant: X-Celeprint Limited

Inventor： Ruggero Loi

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363

Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. At least a portion of each of the sacrificial portions is exposed through an opening. A micro-device is disposed on (e.g., exclusively in direct contact with) each of the sacrificial portions and laterally attached to one of the anchors by a hybrid tether. The hybrid tether comprises an organic tether layer and an inorganic tether layer.

公开(公告)号：US20240118489A1

公开(公告)日：2024-04-11

申请号：US18062844

申请日：2022-12-07

Applicant: X-Celeprint Limited ,  SUSS MicroOptics SA

Inventor： Ronald S. Cok ,  Wilfried Noell ,  David Gomez ,  Ruggero Loi

IPC: G02B6/12 ,  G02B6/138

CPC classification number: G02B6/12004 ,  G02B6/138 ,  G02B2006/12085 ,  G02B2006/12173 ,  G02B2006/12176

Abstract: An exemplary micro-optical component includes a micro-substrate and a micro-optical element disposed on the micro-substrate. The micro-optical element is structured to modify or process light. At least a portion of a component tether is physically attached to the micro-substrate or physically attached to the micro-optical element. The micro-optical component has a thickness less than 250 μm. Light can be processed by reflection, refraction, diffraction, frequency changes, polarization changes, color-temperature or frequency distribution changes, or phase changes. The micro-optical component can be disposed on a system substrate to form a micro-optical system. The system substrate can include a cavity and the micro-optical element can be disposed at least partially in the cavity. Micro-optical components can be passive optical micro-devices. A light-active element can be disposed on the micro-substrate to receive light from or emit light to the micro-optical element.

公开(公告)号：US20230360948A1

公开(公告)日：2023-11-09

申请号：US17955346

申请日：2022-09-28

Applicant: X-Celeprint Limited

Inventor： Ruggero Loi ,  Ronald S. Cok

IPC: H01L21/683 ,  H01L21/76 ,  H01L21/56

CPC classification number: H01L21/6836 ,  H01L21/76 ,  H01L21/561 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: A printed structure includes a target substrate and structures extending from a surface of the target substrate and a component disposed on the surface in alignment with the structures. The structures can be spatially separated independent structures. The component is non-native to the target substrate and can comprises a component substrate separate and independent from the target substrate. The component can be micro-transfer printed to the target substrate and can comprise a broken, fractured, or separated tether.

公开(公告)号：US20240290742A1

公开(公告)日：2024-08-29

申请号：US18584370

申请日：2024-02-22

Applicant: X-Celeprint Limited

Inventor： Ruggero Loi ,  Ronald S. Cok

IPC: H01L23/00

CPC classification number: H01L24/32 ,  H01L24/83 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83

Abstract: A printed structure includes a target substrate having a target-substrate surface, a structure disposed in or on the target substrate, the structures having a structure side that extends at least partially orthogonal to the target-substrate surface, a patterned adhesive layer disposed on the target-substrate surface not in contact with the structure side, and a component having a component side, the component disposed on the patterned adhesive layer with the component side adjacent to the structure side.

公开(公告)号：US20220181185A1

公开(公告)日：2022-06-09

申请号：US17112153

申请日：2020-12-04

Applicant: X-Celeprint Limited

Inventor： Ruggero Loi

IPC: H01L21/683

Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. At least a portion of each of the sacrificial portions is exposed through an opening. A micro-device is disposed on (e.g., exclusively in direct contact with) each of the sacrificial portions and laterally attached to one of the anchors by a hybrid tether. The hybrid tether comprises an organic tether layer and an inorganic tether layer.