公开(公告)号：US20250149390A1

公开(公告)日：2025-05-08

申请号：US18941912

申请日：2024-11-08

Applicant: XILINX, INC.

Inventor： Andy WIDJAJA ,  Lik Huay LIM ,  Henley LIU ,  Jane Wang SOWARDS ,  Mohsen H. MARDI

IPC: H01L21/66 ,  H01L23/00 ,  H01L25/065

Abstract: Methods for fabricating an integrated circuit (IC) device, an IC die configured for probe testing, and an IC device are described therein. In one example, the method includes: forming a conductive cap above and in electrical contact with two or more of a pillars, each pillar coupled to a power contact pads of an IC die, removing the cap after testing; and depositing a hybrid bonding layer over the IC die device, the hybrid bonding layer having hybrid bond pads coupled the plurality of power contact pads and the signal contact pads of the IC die.