公开(公告)号：US20250149390A1

公开(公告)日：2025-05-08

申请号：US18941912

申请日：2024-11-08

Applicant: XILINX, INC.

Inventor： Andy WIDJAJA ,  Lik Huay LIM ,  Henley LIU ,  Jane Wang SOWARDS ,  Mohsen H. MARDI

IPC: H01L21/66 ,  H01L23/00 ,  H01L25/065

Abstract: Methods for fabricating an integrated circuit (IC) device, an IC die configured for probe testing, and an IC device are described therein. In one example, the method includes: forming a conductive cap above and in electrical contact with two or more of a pillars, each pillar coupled to a power contact pads of an IC die, removing the cap after testing; and depositing a hybrid bonding layer over the IC die device, the hybrid bonding layer having hybrid bond pads coupled the plurality of power contact pads and the signal contact pads of the IC die.

公开(公告)号：US20230366929A1

公开(公告)日：2023-11-16

申请号：US17742363

申请日：2022-05-11

Applicant: XILINX, INC.

Inventor： Albert Shih-Huai LIN ,  Niravkumar PATEL ,  Amitava MAJUMDAR ,  Jane Wang SOWARDS

IPC: G01R31/3185 ,  G01R31/317

CPC classification number: G01R31/318555 ,  G01R31/318572 ,  G01R31/31727

Abstract: An integrated circuit (IC) chip device includes testing interface circuitry and testing circuitry to test the operation of the IC chips of the IC chip device. The IC chip device includes a first IC chip that comprises first testing circuitry. The first testing circuitry receives a mode select signal, a clock signal, and encoded signals, and comprises finite state machine (FSM) circuitry, decoder circuitry, and control circuitry. The FSM circuitry determines an instruction based on the mode select signal and the clock signal. The decoder circuitry decodes the encoded signals to generate a decoded signal. The control circuitry generates a control signal from the instruction and the decoded signal. The control signal indicates a test to be performed by the first testing circuitry.