公开(公告)号：US11605886B1

公开(公告)日：2023-03-14

申请号：US17133518

申请日：2020-12-23

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Lik Tsang ,  Jens Weis ,  Brendan Farley ,  Anthony Torza ,  Suresh Ramalingam

IPC: H01Q1/42 ,  H01L23/427 ,  H01Q1/02

Abstract: An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.