Solid BI-layer structures for use with high viscosity inks in acoustic ink printing and methods of fabrication
    1.
    发明申请
    Solid BI-layer structures for use with high viscosity inks in acoustic ink printing and methods of fabrication 有权
    用于声学油墨印刷中的高粘度油墨的固体BI层结构和制造方法

    公开(公告)号:US20020015074A1

    公开(公告)日:2002-02-07

    申请号:US09957710

    申请日:2001-09-20

    CPC classification number: B41J2/14008 B41J2002/14322

    Abstract: Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

    Abstract translation: 低声波固体波衰减结构由电铸镍模形成,并且被结合在声学油墨发射器之间,在聚焦透镜和油墨层的表面之间。 该结构具有声波衰减低的特性,以增加声波发射器内声波传播的效率。 使用所述结构,声墨打印机可以精确地发射具有高粘度的材料,包括热熔油墨。

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