公开(公告)号：US20040087148A1

公开(公告)日：2004-05-06

申请号：US10284538

申请日：2002-10-30

Applicant: Xerox Corporation

Inventor： Kaiser H. Wong

IPC: H01L021/44

CPC classification number: H01L21/76843 ,  H01L21/76849 ,  H01L21/76855 ,  H01L21/76874 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention is directed to a fabrication method of copper interconnects using dual damascene processing. Using silicon to provide an active surface, palladium can be selectively deposited on silicon by immersion plating technique. After palladium deposition (about 1000 A thick), either a layer of cobalt phosphorus or alloy cobalt/nickel phosphorus or nickel phosphorus is deposited on palladium layer using electroless plating technique. This cobalt/phosphorus, cobalt nickel phosphorus alloy, or nickel phosphorus layer serves as a copper diffusion barrier. Via and trench are filled up by copper from electroless copper plating method and CMP is used to remove excess copper and planarize/polish the copper/dielectric surface.

Abstract translation: 本发明涉及使用双镶嵌处理​​的铜互连的制造方法。 使用硅提供活性表面，钯可以通过浸镀技术选择性地沉积在硅上。 在钯沉积（约1000厚）之后，使用化学镀技术在钯层上沉积钴磷或钴/镍磷或镍磷合金层。 该钴/磷，钴镍磷合金或镍磷层用作铜扩散阻挡层。 通孔和沟槽由无电镀铜法填充铜，CMP用于去除多余的铜并平坦化/抛光铜/电介质表面。

公开(公告)号：US20040149585A1

公开(公告)日：2004-08-05

申请号：US10284513

申请日：2003-02-05

Applicant: Xerox Corporation

Inventor： Kaiser H. Wong

IPC: C25D005/02 ,  C25D005/10

CPC classification number: H01F41/041 ,  C25D5/02 ,  C25D7/12 ,  H01F5/003 ,  H05K1/165 ,  H05K3/4644 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2203/0723

Abstract: A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a substrate and then depositing an insulation pattern. Next, depositing a pattern of permeable material to form a core and then depositing polyimide to define vias and permeable core insulation. The vias are filled by electroplating cooper. The vertical spiral inductor is formed defined by next depositing a pattern of top metal (e.g. Copper) lines by electroplating wherein the top metal lines are staggered with respect to the bottom metal lines. Lastly a top protective layer is deposited. The core made be made from a preamble or non-premable material.

Abstract translation: 公开了一种用于在多芯片模块封装内制造垂直螺旋电感器的工艺。 该方法包括通过在衬底上电镀铜然后沉积绝缘图案来沉积底线图案。 接下来，沉积可渗透材料的图案以形成芯，然后沉积聚酰亚胺以限定通孔和可渗透的芯绝缘体。 通孔用电镀铜填充。 垂直螺旋电感器的形成是由下一次通过电镀沉积顶部金属（例如铜）线的图案而定义的，其中顶部金属线相对于底部金属线交错。 最后沉积顶层保护层。 核心由前序或非预先材料制成。

公开(公告)号：US20040060901A1

公开(公告)日：2004-04-01

申请号：US10260509

申请日：2002-09-27

Applicant: Xerox Corporation

Inventor： Kaiser H. Wong

IPC: G11B005/127

CPC classification number: B41J2/16 ,  B41J2/14008 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1643

Abstract: An acoustic ink printing print head utilizing metal alloy 42 is disclosed. Additionally, a process for incorporating the metal alloy 42 (alloy with approximately 42% nickel and 58% iron) to build the liquid level control/aperture plate defining an AIP print head is disclosed. The process consists of fabricating a channel plate and an aperture plate from the metal alloy 42 and bonding the two structures together thereby defining the liquid level control/aperture plate.

Abstract translation: 公开了一种利用金属合金42的声学油墨印刷打印头。 此外，公开了一种用于结合金属合金42（约42％的镍和58％的铁的合金）来构建限定AIP打印头的液位控制/孔板的方法。 该方法包括从金属合金42制造通道板和孔板，并将两个结构结合在一起，从而限定液位控制/孔板。

公开(公告)号：US20040084320A1

公开(公告)日：2004-05-06

申请号：US10284557

申请日：2002-10-30

Applicant: Xerox Corporation

Inventor： Kaiser H. Wong

IPC: C25D005/02

CPC classification number: C25D5/02 ,  C25D7/123 ,  H01L21/2885

Abstract: A method of fabrication of copper interconnect by means of copper electroplating is disclosed. In the conventional method of fabricating copper interconnect for integrated circuits, critical steps such as deposition of copper seed layer and chemical mechanical polishing (CMP) are required. However in this invention, both the seed layer deposition and CMP are not required.

Abstract translation: 公开了一种通过铜电镀制造铜互连的方法。 在用于集成电路的铜互连的常规方法中，需要诸如沉积铜籽晶层和化学机械抛光（CMP）等关键步骤。 然而，在本发明中，不需要种子层沉积和CMP。

公开(公告)号：US20020015074A1

公开(公告)日：2002-02-07

申请号：US09957710

申请日：2001-09-20

Applicant: Xerox Corporation

Inventor： Scott A. Elrod ,  Babur B. Hadimioglu ,  David Steinmetz ,  Kaiser H. Wong

IPC: B41J002/135

CPC classification number: B41J2/14008 ,  B41J2002/14322

Abstract: Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

Abstract translation: 低声波固体波衰减结构由电铸镍模形成，并且被结合在声学油墨发射器之间，在聚焦透镜和油墨层的表面之间。 该结构具有声波衰减低的特性，以增加声波发射器内声波传播的效率。 使用所述结构，声墨打印机可以精确地发射具有高粘度的材料，包括热熔油墨。