Abstract:
A coating method for a hollow substrate including: (a) forming a seamed extended substrate unit composed of a substrate extension device and the substrate, and employing a chuck assembly to internally grip the substrate; (b) dip coating the extended substrate unit while the chuck assembly internally grips the substrate to deposit a layer first on the substrate extension device and then on the substrate; and (c) separating, subsequent to the dip coating the extended substrate unit, the substrate extension device from the substrate.
Abstract:
A coating method for a hollow substrate including: (a) forming a seamed extended substrate unit composed of a substrate extension device and the substrate, and employing a chuck assembly to internally grip the substrate; (b) dip coating the extended substrate unit while the chuck assembly internally grips the substrate to deposit a layer first on the substrate extension device and then on the substrate; and (c) separating, subsequent to the dip coating the extended substrate unit, the substrate extension device from the substrate.