公开(公告)号：US20230376437A1

公开(公告)日：2023-11-23

申请号：US17663824

申请日：2022-05-17

Applicant: Xilinx, Inc.

Inventor： David Patrick Clarke ,  Peter McColgan ,  Juan J. Noguera Serra ,  Tim Tuan ,  Saurabh Mathur ,  Amarnath Kasibhatla ,  Javier Cabezas Rodriguez ,  Pedro Miguel Parola Duarte ,  Zachary Blaise Dickman

IPC: G06F13/28

CPC classification number: G06F13/28 ,  G06F2213/28

Abstract: An integrated circuit (IC) can include a data processing array including a plurality of compute tiles arranged in a grid. The IC can include an array interface coupled to the data processing array. The array interface includes a plurality of interface tiles. Each interface tile includes a plurality of direct memory access circuits. The IC can include a network-on-chip (NoC) coupled to the array interface. Each direct memory access circuit is communicatively linked to the NoC via an independent communication channel.

公开(公告)号：US12164451B2

公开(公告)日：2024-12-10

申请号：US17663824

申请日：2022-05-17

Applicant: Xilinx, Inc.

Inventor： David Patrick Clarke ,  Peter McColgan ,  Juan J. Noguera Serra ,  Tim Tuan ,  Saurabh Mathur ,  Amarnath Kasibhatla ,  Javier Cabezas Rodriguez ,  Pedro Miguel Parola Duarte ,  Zachary Blaise Dickman

IPC: G06F13/28 ,  G06F15/80

Abstract: An integrated circuit (IC) can include a data processing array including a plurality of compute tiles arranged in a grid. The IC can include an array interface coupled to the data processing array. The array interface includes a plurality of interface tiles. Each interface tile includes a plurality of direct memory access circuits. The IC can include a network-on-chip (NoC) coupled to the array interface. Each direct memory access circuit is communicatively linked to the NoC via an independent communication channel.