公开(公告)号：USRE50370E1

公开(公告)日：2025-04-08

申请号：US17880487

申请日：2022-08-24

Applicant: XILINX, INC.

Inventor： Alireza Kaviani ,  Pongstorn Maidee ,  Ivo Bolsens

IPC: G06F13/36 ,  G06F13/00 ,  G06F13/362 ,  G06F13/40

Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.

公开(公告)号：USRE49163E1

公开(公告)日：2022-08-09

申请号：US16891972

申请日：2020-06-18

Applicant: XILINX, INC.

Inventor： Alireza S. Kaviani ,  Pongstorn Maidee ,  Ivo Bolsens

IPC: G06F13/36 ,  G06F13/40 ,  G06F13/362 ,  G06F13/00

Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.

公开(公告)号：US10002100B2

公开(公告)日：2018-06-19

申请号：US15013696

申请日：2016-02-02

Applicant: Xilinx, Inc.

Inventor： Alireza S. Kaviani ,  Pongstorn Maidee ,  Ivo Bolsens

IPC: G06F13/36 ,  G06F13/362 ,  G06F13/00 ,  G06F13/40

CPC classification number: G06F13/4068 ,  G06F13/362 ,  G06F13/4031

Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.

公开(公告)号：US20170220509A1

公开(公告)日：2017-08-03

申请号：US15013696

申请日：2016-02-02

Applicant: Xilinx, Inc.

Inventor： Alireza S. Kaviani ,  Pongstorn Maidee ,  Ivo Bolsens

IPC: G06F13/40 ,  G06F13/362

CPC classification number: G06F13/4068 ,  G06F13/362 ,  G06F13/4031

Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.