公开(公告)号：US10187714B2

公开(公告)日：2019-01-22

申请号：US15490243

申请日：2017-04-18

Applicant: YAMAHA CORPORATION

Inventor： Hideaki Takehisa ,  Nobuhiro Nambu ,  Masamichi Yano ,  Keizo Harada

IPC: H04R1/08 ,  H04R1/28 ,  H04R1/46 ,  H04R3/00 ,  H04R29/00 ,  G10H3/14 ,  H04R1/02 ,  H04R1/04 ,  H04R19/01

Abstract: A sound pickup device includes: a housing; a mount portion via which the housing on an object constituting a portion of a musical instrument; a sound pickup including a plurality of the microphones respectively oriented in different directions; a first output configured to output a sound signal indicating a sound input to the sound pickup; and an installer configured to install the sound pickup on the housing such that each of the plurality of microphones is oriented away from the object when the housing is mounted on the object via the mount portion.

公开(公告)号：US10171901B2

公开(公告)日：2019-01-01

申请号：US15490509

申请日：2017-04-18

Applicant: YAMAHA CORPORATION

Inventor： Hideaki Takehisa ,  Nobuhiro Nambu ,  Masamichi Yano ,  Keizo Harada

IPC: H04R1/08 ,  H04R1/28 ,  H04R3/04 ,  H04R1/46 ,  H04R29/00 ,  G10H3/14 ,  H04R1/02 ,  H04R1/04 ,  H04R19/01

Abstract: A sound pickup device includes: a housing; a mount portion via which the housing is mounted on an object; a sound pickup including a microphone; a first output configured to output a sound signal indicating a sound input to the sound pickup; an installer configured to install the sound pickup on the housing; a sensor configured to detect a vibration transmitted to the housing; and a second output configured to output a vibration signal indicating the vibration detected by the sensor.