公开(公告)号：US20240102194A1

公开(公告)日：2024-03-28

申请号：US18231099

申请日：2023-08-07

Applicant: YUAN ZE UNIVERSITY ,  Innolux Corporation

Inventor： Cheng-EN HO ,  Yu-Lian CHEN ,  Cheng-Chi WANG ,  Yu-Jen CHANG ,  Yung-Sheng LU ,  Cheng-Yu LEE ,  Yu-Ming LIN

IPC: C25D5/18 ,  C25D5/48 ,  C25D17/02

CPC classification number: C25D5/18 ,  C25D5/48 ,  C25D17/02

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.