Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
    1.
    发明授权
    Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories 有权
    防止在氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)存储器中的过程中充电

    公开(公告)号:US07439575B2

    公开(公告)日:2008-10-21

    申请号:US11065312

    申请日:2005-02-23

    IPC分类号: H01L29/792

    摘要: A pre-metal dielectric structure of a SONOS memory structure includes a UV light-absorbing film, which prevents the ONO structure from being electronically charged in response to UV irradiation. In one embodiment, the pre-metal dielectric structure includes a first pre-metal dielectric layer located over the SONOS memory structure, a light-absorbing structure located over the first pre-metal dielectric layer, and a second pre-metal dielectric layer located over the light-absorbing structure. The light-absorbing structure can be a continuous polysilicon or amorphous silicon layer. Alternately, the light-absorbing structure can include one or more patterned polysilicon layers. In another embodiment, the SONOS transistors include UV light absorbing polysilicon spacers.

    摘要翻译: SONOS存储器结构的金属前介电结构包括UV光吸收膜,其防止ONO结构响应于紫外线照射而被电荷充电。 在一个实施例中,预金属电介质结构包括位于SONOS存储器结构之上的第一预金属电介质层,位于第一预金属介电层上方的光吸收结构和位于第一金属前介电层上的第二预金属介电层 光吸收结构。 光吸收结构可以是连续的多晶硅或非晶硅层。 或者,光吸收结构可以包括一个或多个图案化的多晶硅层。 在另一个实施例中,SONOS晶体管包括UV光吸收多晶硅间隔物。

    Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
    2.
    发明授权
    Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories 失效
    防止在氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)存储器中的过程中充电

    公开(公告)号:US06959920B2

    公开(公告)日:2005-11-01

    申请号:US10659031

    申请日:2003-09-09

    摘要: A pre-metal dielectric structure of a SONOS memory structure includes a UV light-absorbing film, which prevents the ONO structure from being electronically charged in response to UV irradiation. In one embodiment, the pre-metal dielectric structure includes a first pre-metal dielectric layer located over the SONOS memory structure, a light-absorbing structure located over the first pre-metal dielectric layer, and a second pre-metal dielectric layer located over the light-absorbing structure. The light-absorbing structure can be a continuous polysilicon or amorphous silicon layer. Alternately, the light-absorbing structure can include one or more patterned polysilicon layers. In another embodiment, the SONOS transistors include UV light absorbing polysilicon spacers.

    摘要翻译: SONOS存储器结构的金属前介电结构包括UV光吸收膜,其防止ONO结构响应于紫外线照射而被电荷充电。 在一个实施例中,预金属电介质结构包括位于SONOS存储器结构之上的第一预金属电介质层,位于第一预金属介电层上方的光吸收结构和位于第一金属前介电层上的第二预金属介电层 光吸收结构。 光吸收结构可以是连续的多晶硅或非晶硅层。 或者,光吸收结构可以包括一个或多个图案化的多晶硅层。 在另一个实施例中,SONOS晶体管包括UV光吸收多晶硅间隔物。

    Protection againts in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
    5.
    发明申请
    Protection againts in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories 有权
    保护在氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)存储器中再次进行过程充电

    公开(公告)号:US20050139903A1

    公开(公告)日:2005-06-30

    申请号:US11065312

    申请日:2005-02-23

    摘要: A pre-metal dielectric structure of a SONOS memory structure includes a UV light-absorbing film, which prevents the ONO structure from being electronically charged in response to UV irradiation. In one embodiment, the pre-metal dielectric structure includes a first pre-metal dielectric layer located over the SONOS memory structure, a light-absorbing structure located over the first pre-metal dielectric layer, and a second pre-metal dielectric layer located over the light-absorbing structure. The light-absorbing structure can be a continuous polysilicon or amorphous silicon layer. Alternately, the light-absorbing structure can include one or more patterned polysilicon layers. In another embodiment, the SONOS transistors include UV light absorbing polysilicon spacers.

    摘要翻译: SONOS存储器结构的金属前介电结构包括UV光吸收膜,其防止ONO结构响应于紫外线照射而被电荷充电。 在一个实施例中,预金属电介质结构包括位于SONOS存储器结构之上的第一预金属电介质层,位于第一预金属介电层上方的光吸收结构和位于第一金属前介电层上的第二预金属介电层 光吸收结构。 光吸收结构可以是连续的多晶硅或非晶硅层。 或者,光吸收结构可以包括一个或多个图案化的多晶硅层。 在另一个实施例中,SONOS晶体管包括UV光吸收多晶硅间隔物。