Methods of inspecting integrated circuit substrates using electron beams
    1.
    发明授权
    Methods of inspecting integrated circuit substrates using electron beams 有权
    使用电子束检查集成电路基板的方法

    公开(公告)号:US06525318B1

    公开(公告)日:2003-02-25

    申请号:US09384885

    申请日:1999-08-27

    IPC分类号: H01J37256

    CPC分类号: G01N23/22 H01J2237/2817

    摘要: Methods of inspecting integrated circuit substrates include the steps of directing a beam of electrons into a first conductive plug located within a first contact hole on an integrated circuit substrate and then measuring a quantity of electrons emitted from the first conductive plug to determine an absence or presence of an electrically insulating residue in the first contact hole. The quantity of electrons emitted from the first conductive plug by secondary electron emission can be measured in order to determine whether electrons are being accumulated within the conductive plug because an insulating residue is blocking passage of the electrons into an underlying conductive portion of the substrate. If an electrically insulating residue is present, then sufficient repulsive forces between the accumulated electrons will result in the secondary emission of excess electrons from an upper surface of the conductive plug as the conductive plug is being irradiated with the electron beam. A detector can then be used to measure the quantity of the emitted electrons against a threshold level, in order determine whether the quantity of electrons emitted by secondary emission is sufficient to indicate that an insulating residue is present in the contact hole.

    摘要翻译: 检查集成电路基板的方法包括以下步骤:将电子束引导到位于集成电路基板上的第一接触孔内的第一导电插塞中,然后测量从第一导电插塞发射的电子量以确定不存在或存在 的第一接触孔中的电绝缘残渣。 可以测量从第一导电插塞通过二次电子发射发射的电子的量,以便确定电子是否积聚在导电插塞内,因为绝缘残留物阻挡电子通过基底的下面的导电部分。 如果存在电绝缘的残留物,则当导电塞被电子束照射时,积聚的电子之间的足够的排斥力将导致从导电塞的上表面二次发射多余的电子。 然后可以使用检测器来测量发射的电子的量相对于阈值水平,以便确定由二次发射发射的电子的量是否足以表明在接触孔中存在绝缘残留物。