摘要:
The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach. The light source module has at least one light emitting unit and a printed circuit board. The light emitting unit is disposed on the printed circuit board, such that an emitting surface of the light emitting unit can face the light incident side of the light guide plate.
摘要:
The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach. The light source module has at least one light emitting unit and a printed circuit board. The light emitting unit is disposed on the printed circuit board, such that an emitting surface of the light emitting unit can face the light incident side of the light guide plate.
摘要:
A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate.
摘要:
A flat panel display module is introduced herein, which principally includes an upper bezel, a liquid crystal panel, a frame, an optical film set and a printed circuit board assembly (PCBA), wherein various types electrical components mounted on the PCBA are capable of being completely or mostly accommodated within a caved structure constructed within the inside of the flat panel display module so as to reduce a thickness of the whole flat panel display module. Simultaneously, a better structural strength for the whole flat panel display module can be achieved therefore by closely stacking up the above-mentioned elements of the whole flat panel display module.
摘要:
A flat panel display module is introduced herein, which principally includes an upper bezel, a liquid crystal panel, a frame, an optical film set and a printed circuit board assembly (PCBA), wherein various types electrical components mounted on the PCBA are capable of being completely or mostly accommodated within a caved structure constructed within the inside of the flat panel display module so as to reduce a thickness of the whole flat panel display module. Simultaneously, a better structural strength for the whole flat panel display module can be achieved therefore by closely stacking up the above-mentioned elements of the whole flat panel display module.
摘要:
A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate.
摘要:
An organic light emitting diode packaging structure and a manufacturing method thereof is provided. The organic light emitting diode packaging structure includes a substrate, an organic light emitting diode, a film, and a metal layer. The organic light emitting diode is disposed on the substrate. The film has a surface facing the substrate. The surface has a recess formed thereon. The metal layer is applied to the surface of the film, so that the metal layer forms an accommodating space in the recess to accommodate the organic light emitting diode. The present invention utilizes the metal layer to package the organic light emitting diode and therefore has the advantages of thinner in thickness and lighter in weight. As a result, the present invention can be applied to large organic light emitting diode products or portable electronic products.
摘要:
A dual display module for use in a display apparatus is provided. The dual display module includes a first display module, a first light source, a second display module, a second light source and a printed circuit board electrically connected with the first display module and the second display module. The second light source, which provides light to the second display module, is directly disposed onto the printed circuit board.
摘要:
A shadow mask and an evaporation system incorporating the same. The shadow mask comprises at least one opening. The length and the width of the opening range from about 100 μm to about 200 μm and from about 25 μm to about 75 μm, respectively.
摘要:
A dual display module for use in a display apparatus is provided. The dual display module includes a first display module, a first light source, a second display module, a second light source and a printed circuit board electrically connected with the first display module and the second display module. The second light source, which provides light to the second display module, is directly disposed onto the printed circuit board.