公开(公告)号：US20060257667A1

公开(公告)日：2006-11-16

申请号：US10542358

申请日：2003-12-24

申请人： Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Yasuo Matsuki

发明人： Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Yasuo Matsuki

IPC分类号： C22C21/02 ,  B32B9/00

CPC分类号： C23C18/08

摘要： A composition for forming a silicon.aluminum film, containing a silicon compound and an aluminum compound. The silicon.aluminum film is obtained by forming a coating film of the above composition and treating it with heat and/or light. The silicon.aluminum film can easily be formed from the above composition by the above method at a low cost without requiring an expensive vacuum apparatus or high-frequency wave generator.

摘要翻译： 一种用于形成含硅化合物和铝化合物的硅铝膜的组合物。 硅铝膜通过形成上述组成的涂膜并用热和/或光进行处理而获得。 通过上述方法可以以低成本容易地由上述组成形成硅铝膜，而不需要昂贵的真空装置或高频波发生器。

公开(公告)号：US20090142617A1

公开(公告)日：2009-06-04

申请号：US12364599

申请日：2009-02-03

申请人： Yasuaki YOKOYAMA ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Yasuo Matsuki

发明人： Yasuaki YOKOYAMA ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Yasuo Matsuki

IPC分类号： B32B9/00 ,  B05D5/12 ,  B05D3/00

CPC分类号： C23C18/08

摘要： A composition for forming a silicon.aluminum film, containing a silicon compound and an aluminum compound. The silicon.aluminum film is obtained by forming a coating film of the above composition and treating it with heat and/or light.

摘要翻译： 一种用于形成含硅化合物和铝化合物的硅铝膜的组合物。 硅铝膜通过形成上述组成的涂膜并用热和/或光进行处理而获得。

公开(公告)号：US20070082965A1

公开(公告)日：2007-04-12

申请号：US10536909

申请日：2003-11-13

申请人： Kyouyu Yasuda ,  Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Nobuo Bessho

发明人： Kyouyu Yasuda ,  Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Nobuo Bessho

IPC分类号： C08G59/68

CPC分类号： G03F7/038

摘要： It is an object of the present invention to provide a novel photo-curing composition which can be cured by light of a wide wavelength region including ultraviolet light or visible light, has such high sensitivity that it can be sufficiently cured by exposure to a small amount of light, can favorably form a fine pattern when used as a resist and provides a cured product having excellent heat resistance and insulating properties, and a negative photoresist composition using the photo-curing composition. It is another object of the present invention to provide a process for highly accurately and easily producing a polyimide thin film used for a medical instrument, and a medical instrument having the polyimide thin film. The photo-curing composition of the present invention comprises (A) a carbon cluster and/or its derivative, having a photosensitizing function, (B) a compound having plural heterocyclic rings in a molecule, and if necessary, (C) a photo-insensitive resin.

摘要翻译： 本发明的目的是提供一种可通过包括紫外光或可见光在内的宽波长区域的光固化的新型光固化组合物，具有这样高的灵敏度，可以通过暴露于少量来充分固化 光可以有利地形成精细图案，并且提供具有优异的耐热性和绝缘性的固化产物，以及使用光固化组合物的负性光致抗蚀剂组合物。 本发明的另一个目的是提供一种用于高度准确且容易地制造用于医疗器械的聚酰亚胺薄膜和具有该聚酰亚胺薄膜的医疗器械的方法。 本发明的光固化性组合物包含（A）具有光敏作用的碳簇和/或其衍生物，（B）分子中具有多个杂环的化合物，根据需要，（C） 不敏感树脂。

公开(公告)号：US20070135543A1

公开(公告)日：2007-06-14

申请号：US10580456

申请日：2004-11-25

申请人： Kyouyu Yasuda ,  Nobuyuki Itou ,  Yasuaki Yokoyama ,  Michiko Yokoyama

发明人： Kyouyu Yasuda ,  Nobuyuki Itou ,  Yasuaki Yokoyama ,  Michiko Yokoyama

IPC分类号： C09J7/02

CPC分类号： C09J11/06 ,  C08K5/05

摘要： [Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300° C., and has a melting temperature width of not more than 30° C. and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group.

摘要翻译： [问题]为了提供用于将半导体晶片等固定到基板上的粘合剂组合物，在晶片研磨阶段中显示出牢固的粘合性，并且通过加热熔化，从而能够在晶片完成之后容易地剥离 研磨阶段。 解决问题的手段本发明的热熔粘合剂组合物是以熔融温度为50〜300℃，熔融温度为30℃以下的结晶化合物为主要成分的组合物 C.熔体粘度不大于0.1Pa·s。 作为主要成分的结晶化合物优选仅由C，H和O元素构成，分子量不超过1000的有机化合物，优选脂族化合物或脂环族化合物，特别优选具有 类固醇骨架和/或羟基。