摘要:
A ferroelectric memory of the present invention comprises: a plurality of normal cells, each of which includes a first ferroelectric capacitor for holding data and a first transistor connected to a first electrode of the first ferroelectric capacitor; a first bit line connected to the first transistor; a first bit line precharge circuit which is a switch circuit provided between the first bit line and a ground; and a word line connected to a gate of the first transistor. The word line is deactivated to disconnect the first ferroelectric capacitor from the first bit line before the first bit line precharge circuit is driven to discharge a potential of the first bit line.
摘要:
Provided is a semiconductor memory device compatible with a SRAM and capable of a high-speed data transfer operation while maintaining data reliability. An access to a memory core 6 starts when an external chip enable signal XCE performs a falling transition. Simultaneously, an external write enable signal XWE and an external address signal ADD are received, and a memory cell 1, in the memory core 6, corresponding to the received external address signal ADD is selected. When a data read-out from the memory cell 1 or a data write-in to the memory cell 1 is complete, a rewrite timer 7 is activated in accordance with a rising transition of an external chip enable signal XCE or a rising transition of the external write enable signal XWE for performing a data rewrite for the memory cell 1.
摘要:
Provided is a semiconductor memory device compatible with a SRAM and capable of a high-speed data transfer operation while maintaining data reliability. An access to a memory core 6 starts when an external chip enable signal XCE performs a falling transition. Simultaneously, an external write enable signal XWE and an external address signal ADD are received, and a memory cell 1, in the memory core 6, corresponding to the received external address signal ADD is selected. When a data read-out from the memory cell 1 or a data write-in to the memory cell 1 is complete, a rewrite timer 7 is activated in accordance with a rising transition of an external chip enable signal XCE or a rising transition of the external write enable signal XWE for performing a data rewrite for the memory cell 1.
摘要:
To provide a semiconductor storage device which can adapt to assembly processes involving different treatment temperatures, can become unrewritable when rewriting of data by the user is prohibited, negates the necessity for developing different semiconductor storage devices, and lowers development cost.A semiconductor storage device is provided with, as areas for storing faulty address information indicating a faulty area and operation mode setting information about the semiconductor storage device, a first setting function storage area 103 formed from electrically-rewritable nonvolatile memory and a second setting function storage area 102 formed from once-rewritable nonvolatile memory. Transfer of faulty address information to a faulty address register 111 and transfer of operation mode setting information to an operation mode register 110 are selectively performed.
摘要:
To provide a semiconductor storage device which can adapt to assembly processes involving different treatment temperatures, can become unrewritable when rewriting of data by the user is prohibited, negates the necessity for developing different semiconductor storage devices, and lowers development cost. A semiconductor storage device is provided with, as areas for storing faulty address information indicating a faulty area and operation mode setting information about the semiconductor storage device, a first setting function storage area 103 formed from electrically-rewritable nonvolatile memory and a second setting function storage area 102 formed from once-rewritable nonvolatile memory. Transfer of faulty address information to a faulty address register 111 and transfer of operation mode setting information to an operation mode register 110 are selectively performed.
摘要:
Provided is a semiconductor memory device compatible with a SRAM and capable of a high-speed data transfer operation while maintaining data reliability. An access to a memory core 6 starts when an external chip enable signal XCE performs a falling transition. Simultaneously, an external write enable signal XWE and an external address signal ADD are received, and a memory cell 1, in the memory core 6, corresponding to the received external address signal ADD is selected. When a data read-out from the memory cell 1 or a data write-in to the memory cell 1 is complete, a rewrite timer 7 is activated in accordance with a rising transition of an external chip enable signal XCE or a rising transition of the external write enable signal XWE for performing a data rewrite for the memory cell 1.
摘要:
A ferroelectric memory of the present invention comprises: a plurality of normal cells, each of which includes a first ferroelectric capacitor for holding data and a first transistor connected to a first electrode of the first ferroelectric capacitor; a first bit line connected to the first transistor; a first bit line precharge circuit which is a switch circuit provided between the first bit line and a ground; and a word line connected to a gate of the first transistor. The word line is deactivated to disconnect the first ferroelectric capacitor from the first bit line before the first bit line precharge circuit is driven to discharge a potential of the first bit line.
摘要:
A semiconductor memory device is provided with plural memory cells, plural bit lines BL, each bit line being commonly connected to the plural memory cells that are arranged in the same row, plural word lines WL and plural plate lines CP, each word line and each plate line being commonly connected to the plural memory cells that are arranged in the same column, plural plate voltage supply lines CPS arranged in the column direction, and means for electrically connecting each of the plural plate voltage supply lines to each of the corresponding plural plate lines. The plate voltage supply lines are composed of a material having a resistance lower than that of the plate lines, each of capacitors of the plural memory cells is covered with a hydrogen barrier film HB at its periphery, the plural plate voltage supply lines are disposed beneath the hydrogen barrier film HB, and the plural plate voltage supply lines CPS are, when viewed in a plane, electrically connected to the same plate line at plural positions of the same plate line, within a region where the hydrogen barrier film is disposed.
摘要:
A semiconductor memory device is provided with plural memory cells, plural bit lines BL, each bit line being commonly connected to the plural memory cells that are arranged in the same row, plural word lines WL and plural plate lines CP, each word line and each plate line being commonly connected to the plural memory cells that are arranged in the same column, plural plate voltage supply lines CPS arranged in the column direction, and means for electrically connecting each of the plural plate voltage supply lines to each of the corresponding plural plate lines. The plate voltage supply lines are composed of a material having a resistance lower than that of the plate lines, each of capacitors of the plural memory cells is covered with a hydrogen barrier film HB at its periphery, the plural plate voltage supply lines are disposed beneath the hydrogen barrier film HB, and the plural plate voltage supply lines CPS are, when viewed in a plane, electrically connected to the same plate line at plural positions of the same plate line, within a region where the hydrogen barrier film is disposed.
摘要:
A memory cell array is composed of a plurality of memory cells arranged in a matrix. Each of the memory cells includes: a capacitor having a plate electrode connected to a common cell plate and a storage electrode; and a transistor provided between the storage electrode of the capacitor and a bit line, with a gate connected to a word line. A first amplifier amplifies an I/O line pair to a first voltage and a second voltage higher than the first voltage. A second amplifier amplifies a bit line pair to the first voltage and a third voltage higher than the second voltage. A switch element switches the connection relationship between the I/O line pair and the bit line pair among a connected state, a disconnected state and a transmission limited state in which the potential transmitted is limited.