摘要:
In rewriting processing of logical sectors, data of the transferred logical sectors are temporarily stored in a memory buffer. When the buffer memory has been full filled with data, the data is written into a flash memory. In rewriting processing for the flash memory including a writing unit (page) having a capacity larger than a minimum writing unit (sector) from outside, the number of executions of the evacuation processing can be reduced and the fast data rewriting can be performed. Thus, it is possible to rationalize the evacuation processing for old data caused in the rewriting in units of sectors and to improve the data rewriting speed.
摘要:
A ferroelectric memory of the present invention comprises: a plurality of normal cells, each of which includes a first ferroelectric capacitor for holding data and a first transistor connected to a first electrode of the first ferroelectric capacitor; a first bit line connected to the first transistor; a first bit line precharge circuit which is a switch circuit provided between the first bit line and a ground; and a word line connected to a gate of the first transistor. The word line is deactivated to disconnect the first ferroelectric capacitor from the first bit line before the first bit line precharge circuit is driven to discharge a potential of the first bit line.
摘要:
Provided is a semiconductor memory device compatible with a SRAM and capable of a high-speed data transfer operation while maintaining data reliability. An access to a memory core 6 starts when an external chip enable signal XCE performs a falling transition. Simultaneously, an external write enable signal XWE and an external address signal ADD are received, and a memory cell 1, in the memory core 6, corresponding to the received external address signal ADD is selected. When a data read-out from the memory cell 1 or a data write-in to the memory cell 1 is complete, a rewrite timer 7 is activated in accordance with a rising transition of an external chip enable signal XCE or a rising transition of the external write enable signal XWE for performing a data rewrite for the memory cell 1.
摘要:
A semiconductor memory apparatus is provided which has a simple circuit configuration and is capable of randomly accessing fuse data. In the semiconductor memory apparatus of the present invention, a fuse cell 30 including a fuse 31 is connected to a pair of bit lines of a memory circuit. The fuse 31 and a fuse data output circuit (which includes a resistor 32 and an inverter 33) are connected to a pair of bit lines BLT and BLB of the memory circuit through a fuse selection switch 34. In the semiconductor memory apparatus of the present invention, by allowing a column decoder 12 for selecting a pair of bit lines of the memory cell to also function as a decoder circuit for selecting a fuse, the bit lines of the memory circuit can be used as signal lines for outputting fuse data, whereby the circuit size is reduced and the circuit area is reduced.
摘要:
To restrain an increase in power consumption and a reduction in access speed, the following structure is adopted: An address is input to a row address input circuit and in correspondence with a row address output from the row address input circuit, a predecode signal is output from a row predecode circuit. An address is input to a block-select-signal generating circuit from which first and second block select signals are output for selecting either one of the first and second memory cell array blocks. First and second predecode-signal hold circuits provided in correspondence with the first and second memory cell array blocks hold predecode signals. First and second predecode signals held by the first and second predecode signal hold circuits are supplied to first and second row decode circuits, respectively, and the first and second predecode-signal hold circuits corresponding to the first and second block select signals update the contents being held.
摘要:
In a driver circuit for driving a pair of data lines, the amplitude of a differential input signal is reduced from 2.5 V to 0.6 V, which is smaller than a conventional lower-limit source voltage (approximately 1.5 V). The amplitude of the differential signal transmitted through the pair of data lines is amplified to 2.5 V by an amplifying circuit and the resulting signal is then latched by a latch circuit. After the latching by the latch circuit, the operation of the amplifying circuit is halted. The driver circuit is constituted solely by a plurality of NMOS transistors so as not to increase a leakage current flowing in the off state. Here, the threshold voltage of the NMOS transistor positioned on the ground side is reduced to a conventional lower-limit value (0.3 V to 0.6 V), while the threshold voltage of the NMOS transistor on the power-source side to a value lower than the above lower-limit value (0 V to 0.3 V), thereby enhancing a driving force of the NMOS transistor on the power-source side.
摘要:
In a driver circuit for driving a pair of data lines, the amplitude of a differential input signal is reduced from 2.5 V to 0.6 V, which is smaller than a conventional lower-limit source voltage (approximately 1.5 V). The amplitude of the differential signal transmitted through the pair of data lines is amplified to 2.5 V by an amplifying circuit and the resulting signal is then latched by a latch circuit. After the latching by the latch circuit, the operation of the amplifying circuit is halted. The driver circuit is constituted solely by a plurality of NMOS transistors so as not to increase a leakage current flowing in the off state. Here, the threshold voltage of the NMOS transistor positioned on the ground side is reduced to a conventional lower-limit value (0.3 V to 0.6 V), while the threshold voltage of the NMOS transistor on the power-source side to a value lower than the above lower-limit value (0 V to 0.3 V), thereby enhancing a driving force of the NMOS transistor on the power-source side.
摘要:
An external power supply voltage V.sub.CC is applied to a peripheral circuit as a first internal power supply voltage V.sub.PERI. A power supply voltage control circuit outputs a voltage control signal V.sub.SIG of a high logic level if V.sub.CC is not greater than a low limit voltage V.sub.0L in a voltage range specified by VCC recommended operating conditions, otherwise it outputs V.sub.SIG of a low logic level. A power supply circuit applies a second internal power supply voltage V.sub.W and a third internal power supply voltage V.sub.WORD to a memory cell section. V.sub.W is equal to V.sub.PERI if V.sub.SIG is HIGH, while on the other hand V.sub.W is a voltage as a result of boosting V.sub.PERI. V.sub.WORD is a voltage as a result of boosting VW to a further extent. A row decoder sends out V.sub.W onto an enable signal line of a row of sense amplifiers, and V.sub.WORD onto a word line of a memory cell array so that V.sub.W becomes a high-logic-level data write voltage to a memory cell. This adequately prolongs the data-holding time with no sacrifice in memory cell voltage resistance.
摘要:
A semiconductor memory device includes a plurality of memory cells connected to a common bit line, a plurality of select lines each configured to select at least one of the memory cells, a plurality of drive circuits each configured to drive at least one of the select lines, a sense amplifier configured to amplify a voltage occurring at the bit line depending on data stored in the selected memory cell. A memory region where the memory cells are provided has a first region and a second region. When the first region is read, a larger number of the select lines are simultaneously driven by the corresponding common drive circuit than those in the second region, and a larger number of the memory cells are simultaneously selected than those in the second region.
摘要:
A semiconductor memory device includes a plurality of memory cells connected to a common bit line, a plurality of select lines each configured to select at least one of the memory cells, a plurality of drive circuits each configured to drive at least one of the select lines, a sense amplifier configured to amplify a voltage occurring at the bit line depending on data stored in the selected memory cell. A memory region where the memory cells are provided has a first region and a second region. When the first region is read, a larger number of the select lines are simultaneously driven by the corresponding common drive circuit than those in the second region, and a larger number of the memory cells are simultaneously selected than those in the second region.