公开(公告)号：US20120146217A1

公开(公告)日：2012-06-14

申请号：US13071515

申请日：2011-03-25

Applicant: Yen-Chieh Lin

Inventor： Yen-Chieh Lin

IPC: H01L23/498

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014

Abstract: A conductive pad structure, configured in a peripheral circuit area of a device substrate, is provided. The conductive pad structure includes a conductive pad and a plurality of conductive spacers. The conductive spacers are configured on the conductive pad and arranged as a non-closed pattern on the conductive pad. Besides, a chip package structure and a device substrate that both have the above-mentioned conductive pad structure are also provided.

Abstract translation: 提供了一种配置在器件基板的外围电路区域中的导电焊盘结构。 导电焊盘结构包括导电焊盘和多个导电间隔件。 导电间隔件构造在导电焊盘上并且在导电焊盘上被布置成非闭合图案。 此外，还提供了具有上述导电焊盘结构的芯片封装结构和器件基板。

公开(公告)号：US08482122B2

公开(公告)日：2013-07-09

申请号：US13071515

申请日：2011-03-25

Applicant: Yen-Chieh Lin

Inventor： Yen-Chieh Lin

IPC: H01L23/48

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014

Abstract: A conductive pad structure, configured in a peripheral circuit area of a device substrate, is provided. The conductive pad structure includes a conductive pad and a plurality of conductive spacers. The conductive spacers are configured on the conductive pad and arranged as a non-closed pattern on the conductive pad. Besides, a chip package structure and a device substrate that both have the above-mentioned conductive pad structure are also provided.

Abstract translation: 提供了一种配置在器件基板的外围电路区域中的导电焊盘结构。 导电焊盘结构包括导电焊盘和多个导电间隔件。 导电间隔件构造在导电焊盘上并且在导电焊盘上被布置为非闭合图案。 此外，还提供了具有上述导电焊盘结构的芯片封装结构和器件基板。