公开(公告)号：US12119321B2

公开(公告)日：2024-10-15

申请号：US17947536

申请日：2022-09-19

Applicant: EPISTAR CORPORATION

Inventor： Shih-An Liao ,  Shau-Yi Chen ,  Ming-Chi Hsu ,  Chun-Hung Liu ,  Min-Hsun Hsieh

IPC: H01L23/48 ,  H01L23/00 ,  H01L33/62 ,  H01L33/30 ,  H01L33/64

CPC classification number: H01L24/16 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L33/30 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/0612 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29324 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29313 ,  H01L2924/00014 ,  H01L2224/29309 ,  H01L2924/00014 ,  H01L2224/29311 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2224/29311 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/83203 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US12057377B2

公开(公告)日：2024-08-06

申请号：US17838949

申请日：2022-06-13

Applicant: Magnachip Semiconductor, Ltd.

Inventor： Hyun Dong Kim

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49537 ,  H01L21/56 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/29 ,  H01L24/45 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45616 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48175 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/0665 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45616 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/01005

Abstract: A multichip package and a method for manufacturing the same are provided. A multichip package includes: a plurality of semiconductor chips each mounted on corresponding lead frame pads; lead frames connected to the semiconductor chips by a bonding wire; and fixed frames integrally formed with at least one of the lead frame pads and configured to support the lead frame pads on a package-forming substrate.

公开(公告)号：US12034260B2

公开(公告)日：2024-07-09

申请号：US17054414

申请日：2019-06-06

Applicant: DEXERIALS CORPORATION

Inventor： Ryota Aizaki ,  Kosuke Asaba

IPC: H05K1/11 ,  H01L23/00 ,  H01R4/04 ,  H01R12/62 ,  H05K1/09 ,  H05K1/18

CPC classification number: H01R4/04 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01R12/62 ,  H05K1/092 ,  H05K1/11 ,  H05K1/18 ,  H01L2224/32221 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211

Abstract: A connection body, a method for manufacturing a connection body, and a connection method which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. In a connection body in which a first component having a first electrode and a second component having a second electrode are connected to each other via a filler-containing film having a filler-aligned layer in which independent fillers are aligned in a binder resin layer, the maximum effective connection portion area where the first electrode and the second electrode face each other is 4,000 μm2 or less and a ratio of the effective connection portion area to a particle area on the connection portion projection plane is 3 or more.

公开(公告)号：US20240170435A1

公开(公告)日：2024-05-23

申请号：US18419382

申请日：2024-01-22

Applicant: Micron Technology, Inc.

Inventor： Eiichi Nakano ,  Mark E. Tuttle

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/279 ,  H01L2224/29076 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/83851

Abstract: An anisotropic conductive film (ACF) is formed with an ordered array of discrete regions that include a conductive carbon-based material. The discrete regions, which may be formed at small pitch, are embedded in at least one adhesive dielectric material. The ACF may be used to mechanically and electrically interconnect conductive elements of initially-separate semiconductor dice in semiconductor device assemblies. Methods of forming the ACF include forming a precursor structure with the conductive carbon-based material and then joining the precursor structure to a separately-formed structure that includes adhesive dielectric material to be included in the ACF. Sacrificial materials of the precursor structure may be removed and additional adhesive dielectric material formed to embed the discrete regions with the conductive carbon-based material in the adhesive dielectric material of the ACF.

公开(公告)号：US11923335B2

公开(公告)日：2024-03-05

申请号：US17472883

申请日：2021-09-13

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro Shinohara

IPC: H01L23/00 ,  C08K3/08 ,  C09J7/20 ,  C09J9/02 ,  H05K3/32

CPC classification number: H01L24/83 ,  C09J7/20 ,  C09J9/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  C08K3/08 ,  C08K2201/001 ,  C09J2203/326 ,  C09J2301/314 ,  C09J2301/408 ,  C09J2463/00 ,  C09J2467/006 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13144 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H05K3/323 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29357 ,  H01L2924/00014 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29364 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/0635 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29387 ,  H01L2924/05442 ,  H01L2224/29387 ,  H01L2924/05432 ,  H01L2224/29387 ,  H01L2924/05432 ,  H01L2924/01001 ,  H01L2224/271 ,  H01L2924/00012 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/83101 ,  H01L2924/00012 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83

Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.

公开(公告)号：US11923333B2

公开(公告)日：2024-03-05

申请号：US17690276

申请日：2022-03-09

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu

IPC: H01L23/00

CPC classification number: H01L24/32 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29082 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/83203 ,  H01L2224/83851

Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.

公开(公告)号：US11881468B2

公开(公告)日：2024-01-23

申请号：US17456066

申请日：2021-11-22

Applicant: Micron Technology, Inc.

Inventor： Eiichi Nakano ,  Mark E. Tuttle

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/279 ,  H01L2224/2919 ,  H01L2224/29076 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/83851

Abstract: An anisotropic conductive film (ACF) is formed with an ordered array of discrete regions that include a conductive carbon-based material. The discrete regions, which may be formed at small pitch, are embedded in at least one adhesive dielectric material. The ACF may be used to mechanically and electrically interconnect conductive elements of initially-separate semiconductor dice in semiconductor device assemblies. Methods of forming the ACF include forming a precursor structure with the conductive carbon-based material and then joining the precursor structure to a separately-formed structure that includes adhesive dielectric material to be included in the ACF. Sacrificial materials of the precursor structure may be removed and additional adhesive dielectric material formed to embed the discrete regions with the conductive carbon-based material in the adhesive dielectric material of the ACF.

公开(公告)号：US11856828B2

公开(公告)日：2023-12-26

申请号：US17498148

申请日：2021-10-11

Applicant: Samsung Display Co., Ltd.

Inventor： Joo-Nyung Jang

IPC: H10K59/131 ,  H01L23/00 ,  H10K59/12

CPC classification number: H10K59/131 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29257 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/12044 ,  H10K59/1201

Abstract: A method of manufacturing a display device including the steps of providing a lower substrate having a display area and a pad area, forming a display structure in the display area of the lower substrate, forming pad electrodes in the pad area of the lower substrate to be spaced apart from each other in a first direction parallel to a top surface of the lower substrate, forming an upper substrate on the display structure to face the lower substrate in the display area, forming a conductive film member including a non-cured resin layer and conductive balls arranged in a lattice shape on the pad electrodes, the non-cured resin layer overlapping the pad electrodes, and forming a film package on the non-cured resin layer, the film package including bump electrodes overlapping the pad electrodes.

公开(公告)号：US11848303B2

公开(公告)日：2023-12-19

申请号：US17744177

申请日：2022-05-13

Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Yongtaek Hong ,  Hyungsoo Yoon ,  Eunho Oh ,  Byeongmoon Lee ,  Sujin Jeong

IPC: H01L23/00 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/2744 ,  H01L2224/32227 ,  H01L2224/83005 ,  H01L2224/83143 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83986

Abstract: The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

公开(公告)号：US11764491B2

公开(公告)日：2023-09-19

申请号：US17326697

申请日：2021-05-21

Applicant: ADAPTIVE REGELSYSTEME GESELLSCHAFT M.B.H. ,  TEXIBLE GMBH ,  “ZAZA” TEXTILLÖSUNGEN GMBH

Inventor： Ulrich Klapper ,  Thomas Fröis ,  Monika Repnik-Hotz

IPC: H01R4/04 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01R4/04 ,  H05K1/0203 ,  H05K1/038 ,  H05K1/181 ,  H05K3/305 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/83851 ,  H05K2201/10106

Abstract: Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.