Semiconductor structure and method for forming thereof
    1.
    发明申请
    Semiconductor structure and method for forming thereof 审中-公开
    半导体结构及其形成方法

    公开(公告)号:US20060286730A1

    公开(公告)日:2006-12-21

    申请号:US11154377

    申请日:2005-06-15

    IPC分类号: H01L21/8234 H01L21/336

    摘要: A semiconductor structure and a method for forming the semiconductor structure are provided. The method for forming a semiconductor structure of the present invention may include the following steps. First, a substrate is provided, wherein a gate is formed over the substrate, and a plurality of offspacers are formed over a sidewall of the gate. Then, a source/drain trench is formed in the substrate at two sides of the gate respectively. Next, an outermost offspacer of the offspacers is removed to expose a flat surface on a surface of the substrate. Thereafter, the source/drain trenches are filled to form a source/drain region. Then, a lightly doped drain (LDD) region is formed in a portion of the substrate under the flat surface.

    摘要翻译: 提供半导体结构和形成半导体结构的方法。 本发明的半导体结构的形成方法可以包括以下步骤。 首先,提供衬底,其中在衬底上形成栅极,并且在栅极的侧壁上方形成多个脱离层。 然后,在栅极的两侧分别在衬底中形成源极/漏极沟槽。 接下来,除去离子的最外层的隔离物以露出基底表面上的平坦表面。 此后,填充源极/漏极沟槽以形成源极/漏极区域。 然后,在平坦表面下的基板的一部分中形成轻掺杂漏极(LDD)区域。