摘要:
An edge sealing glue head for bonding a substrate assembly in a solar module device is provided, and includes: an elongated body having a groove along a length direction of the elongated body, wherein the groove has a first side edge, a second side edge and a bottom; and a fixing strip which is in an elongated shape and is connected to the first side edge of the groove along a length direction of the elongated body, thereby contacting a substrate assembly which gets into the groove, wherein the fixing strip, the groove and the substrate assembly collaboratively define a space for an adhesive to fill in.