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公开(公告)号：US20120192909A1
公开(公告)日：2012-08-02
申请号：US13444344
申请日：2012-04-11
IPC分类号： H01L35/30
CPC分类号： H01L35/28 , H05K7/20772
摘要： An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.
摘要翻译： 电子系统包括容纳至少一个电子系统组件和发电系统的电子系统柜。 发电系统包括具有产生冷却能量的冷却介质的冷却系统。 发电系统还包括具有第一侧和第二侧的热电转换元件。 第一侧与至少一个电子系统部件处于热交换关系，第二侧与冷却介质处于热交换关系。 由至少一个电子系统部件产生的热能提高了第一侧的温度，并且由冷却介质产生的冷却能降低了第二侧的温度以建立温度差。 热电转换元件基于温差产生电动势。
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公开(公告)号：US08901410B2
公开(公告)日：2014-12-02
申请号：US13444344
申请日：2012-04-11
CPC分类号： H01L35/28 , H05K7/20772
摘要： An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.
摘要翻译： 电子系统包括容纳至少一个电子系统组件和发电系统的电子系统柜。 发电系统包括具有产生冷却能量的冷却介质的冷却系统。 发电系统还包括具有第一侧和第二侧的热电转换元件。 第一侧与至少一个电子系统部件处于热交换关系，第二侧与冷却介质处于热交换关系。 由至少一个电子系统部件产生的热能提高了第一侧的温度，并且由冷却介质产生的冷却能降低了第二侧的温度以建立温度差。 热电转换元件基于温差产生电动势。
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公开(公告)号：US20100043858A1
公开(公告)日：2010-02-25
申请号：US12194669
申请日：2008-08-20
CPC分类号： H01L35/28 , H05K7/20772
摘要： An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.
摘要翻译： 电子系统包括容纳至少一个电子系统组件和发电系统的电子系统柜。 发电系统包括具有产生冷却能量的冷却介质的冷却系统。 发电系统还包括具有第一侧和第二侧的热电转换元件。 第一侧与至少一个电子系统部件处于热交换关系，第二侧与冷却介质处于热交换关系。 由至少一个电子系统部件产生的热能提高了第一侧的温度，并且由冷却介质产生的冷却能降低了第二侧的温度以建立温度差。 热电转换元件基于温差产生电动势。
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公开(公告)号：US07751191B2
公开(公告)日：2010-07-06
申请号：US12192231
申请日：2008-08-15
CPC分类号： H05K7/20563 , H05K7/20572 , Y10S257/93
摘要： A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.
摘要翻译： 提供了一种促进其中包括热源的装置的冷却的冷却系统，所述冷却系统包括：冷却单元，其从所述热源的上游吸收来自外部的吸入空气的热量以冷却所述热量 来源并将热量散发到进气的流路的外部; 以及流体控制单元，其使流体朝向所述冷却单元流动，以将从所述冷却单元吸收的热量从所述进气排出到所述冷却单元的外部。
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公开(公告)号：US20090059518A1
公开(公告)日：2009-03-05
申请号：US12192231
申请日：2008-08-15
CPC分类号： H05K7/20563 , H05K7/20572 , Y10S257/93
摘要： A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.
摘要翻译： 提供了一种促进其中包括热源的装置的冷却的冷却系统，所述冷却系统包括：冷却单元，其从所述热源的上游吸收来自外部的吸入空气的热量以冷却所述热量 来源并将热量散发到进气的流路的外部; 以及流体控制单元，其使流体朝向所述冷却单元流动，以将从所述冷却单元吸收的热量从所述进气排出到所述冷却单元的外部。
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6.发明授权公开(公告)号：US07301767B2
公开(公告)日：2007-11-27
申请号：US11259314
申请日：2005-10-26
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).
摘要翻译： 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，连接装置，并且用于根据壳体中的温度将散热器连接到壳体，并且 形成从电子部件到壳体的热传导路径，以及用于使冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。
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公开(公告)号：US07480141B2
公开(公告)日：2009-01-20
申请号：US11837637
申请日：2007-08-13
IPC分类号： H05K7/20 , G02F1/1333
CPC分类号： G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).
摘要翻译： 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，用于根据壳体中的温度将散热器连接到壳体的连接装置，以及用于形成 从电子部件到壳体的热传导路径，以及用于将冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。
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8.发明授权System for cooling interior and external housing surfaces of an electronic apparatus 失效用于冷却电子设备的内部和外部外壳表面的系统公开(公告)号：US07480140B2
公开(公告)日：2009-01-20
申请号：US11225291
申请日：2005-09-13
申请人： Chikashi Hara , Kazuyo Hayakawa , Satoru Kumai , Taichiroh Nomura , Toshio Sakurai , Hiroyuki Takenoshita
发明人： Chikashi Hara , Kazuyo Hayakawa , Satoru Kumai , Taichiroh Nomura , Toshio Sakurai , Hiroyuki Takenoshita
CPC分类号： H05K7/20145
摘要： A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.
摘要翻译： 一种用于冷却电子设备的内部和外部壳体表面的系统。 该装置包括至少一个电子部件，用于传送到由电子部件产生的装置的外表面的传热机构，以及用于冷却装置的外表面的冷却机构。 冷却机构还包括气流产生装置和开口，其使得气流能够同时流过装置内的至少一个电子部件并在外表面上流动以消散由至少一个电子部件产生的热量。
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9.发明申请公开(公告)号：US20060126289A1
公开(公告)日：2006-06-15
申请号：US11259314
申请日：2005-10-26
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).
摘要翻译： 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，连接装置，并且用于根据壳体中的温度将散热器连接到壳体，并且 形成从电子部件到壳体的热传导路径，以及用于使冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。
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公开(公告)号：US5669605A
公开(公告)日：1997-09-23
申请号：US626407
申请日：1996-04-02
CPC分类号： B65H27/00 , B65H2404/133 , B65H2404/142 , B65H2404/144 , B65H2404/181 , B65H2404/185
摘要： There is provided a paper feed roller capable of being used for delivering and feeding paper, which is high in coefficient of friction, has sufficient hardwearing properties with the coefficient of friction not affected by the change in environment of temperature and humidity, is low in ink transferability and is small in change in passage of year of the coefficient of friction of the surface. A coating layer 5 formed of an elastic material such as rubber is formed on an surface of a core material 4 molded of a foamed material such as sponge, and a bonding agent 6 having an elasticity such as denatured silicon is coated on the surface of the coating layer 5 so that ceramic particles 7 are fixed without clearance to provide a paper feed roller 1. Alternatively, the bonding agent 6 is directly coated on the surface of the core material 4 molded of a pliable material such as soft rubber and sponge so that the ceramic particles 7 are fixed without clearance to provide the paper feed roller 9.
摘要翻译： 提供了一种能够用于输送和输送纸张的进纸辊，其摩擦系数高，具有足够的耐磨性能，摩擦系数不受温度和湿度环境变化的影响，油墨量低 可转移性，表面摩擦系数年份变化小。 在由诸如海绵的发泡材料模制的芯材4的表面上形成由诸如橡胶的弹性材料形成的涂层5，并且具有诸如变性硅的弹性的粘合剂6涂覆在 涂层5，使得陶瓷颗粒7在没有间隙的情况下被固定以提供给纸辊1.或者，粘合剂6直接涂覆在由诸如软橡胶和海绵的柔韧材料模制的芯材4的表面上，使得 陶瓷颗粒7没有间隙地固定以提供给纸辊9。
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