HYBRID HEAT DISSIPATION DEVICE
    1.
    发明申请
    HYBRID HEAT DISSIPATION DEVICE 失效
    混合散热装置

    公开(公告)号:US20070139886A1

    公开(公告)日:2007-06-21

    申请号:US11306194

    申请日:2005-12-19

    IPC分类号: H05K7/20

    摘要: A heat dissipation device includes a plurality of first, second and third fins arranged side by side and a fan. The fins define a plurality of parallel channels therein respectively for air flowing therethrough. The fan and the channels of the first fins corporately define an enhanced airflow path which is isolated from the channels of the second and third fins so that the fan entirely impels an airflow generated by the fan to pass through the channels of the first fins. The first fins are located corresponding to a portion of a bottom surface of a base for contacting with a heat-generating electronic component.

    摘要翻译: 散热装置包括并排布置的多个第一,第二和第三散热片和风扇。 翅片分别在其中限定多个平行通道,用于流过其中的空气。 风扇和第一鳍片的通道共同限定了增强的气流路径,其与第二和第三鳍片的通道隔离,使得风扇完全推动由风扇产生的气流通过第一鳍片的通道。 第一散热片对应于与发热电子部件接触的基座的底面的一部分。

    Fixing apparatus for mounting a heat sink to a printed circuit board
    2.
    发明授权
    Fixing apparatus for mounting a heat sink to a printed circuit board 失效
    用于将散热器安装到印刷电路板的固定装置

    公开(公告)号:US07068513B1

    公开(公告)日:2006-06-27

    申请号:US11244586

    申请日:2005-10-05

    IPC分类号: H05K7/20

    摘要: A fixing apparatus includes a retention module (10) and a back plate (30). The retention module is attached on a printed circuit board (20), which defines a plurality of through apertures (22). The retention module comprises a plurality of posts (12) depending therefrom. Each post is hollow and aligned with a corresponding through aperture. The back plate is attached on a bottom surface of the printed circuit board, for reinforcing the printed circuit board. The back plate comprises a plurality of upwardly extending poles (32). The poles extend through the through apertures and lock inside of the posts to secure the retention module and the back plate on opposites sides of the printed circuit board.

    摘要翻译: 定影装置包括保持模块(10)和背板(30)。 保持模块附接在限定多个通孔(22)的印刷电路板(20)上。 保持模块包括从其悬垂的多个柱(12)。 每个柱是中空的并且与对应的通孔对齐。 背板安装在印刷电路板的底表面上,用于加强印刷电路板。 背板包括多个向上延伸的极(32)。 杆延伸穿过通孔并锁定在柱的内部,以将保持模块和背板固定在印刷电路板的相对侧上。

    Hybrid heat dissipation device
    3.
    发明授权
    Hybrid heat dissipation device 失效
    混合散热装置

    公开(公告)号:US07447027B2

    公开(公告)日:2008-11-04

    申请号:US11306194

    申请日:2005-12-19

    IPC分类号: H05K7/20

    摘要: A heat dissipation device includes a plurality of first, second and third fins arranged side by side and a fan. The fins define a plurality of parallel channels therein respectively for air flowing therethrough. The fan and the channels of the first fins corporately define an enhanced airflow path which is isolated from the channels of the second and third fins so that the fan entirely impels an airflow generated by the fan to pass through the channels of the first fins. The first fins are located corresponding to a portion of a bottom surface of a base for contacting with a heat-generating electronic component.

    摘要翻译: 散热装置包括并排布置的多个第一,第二和第三散热片和风扇。 翅片分别在其中限定多个平行通道,用于流过其中的空气。 风扇和第一鳍片的通道共同限定了增强的气流路径,其与第二和第三鳍片的通道隔离,使得风扇完全推动由风扇产生的气流通过第一鳍片的通道。 第一散热片对应于与发热电子部件接触的基座的底面的一部分。

    Heat sink assembly
    4.
    发明授权

    公开(公告)号:US07304845B2

    公开(公告)日:2007-12-04

    申请号:US11265344

    申请日:2005-11-02

    IPC分类号: H05K7/20

    摘要: A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardly extending to engage in the slot, and a fastening lug (28) secured to a recessed portion (122) of a top surface of a base (12) of the heat sink. The fastening lug extending from a baffle (24) which fittingly engages with a raised portion (124) of the top surface of the base adjacent to the recessed portion.

    HEAT DISSIPATION DEVICE WITH A HEAT PIPE
    5.
    发明申请
    HEAT DISSIPATION DEVICE WITH A HEAT PIPE 审中-公开
    带散热管的散热装置

    公开(公告)号:US20070051498A1

    公开(公告)日:2007-03-08

    申请号:US11308392

    申请日:2006-03-21

    IPC分类号: F28F27/02

    摘要: A heat dissipation device includes a seat and a base having a first face and a second face opposite to the first face and thermally contacting the seat. A plurality of fins extends from the first face of the base. Two heat pipes are thermally arranged on the second face of the base. Each of the two heat pipes is bent and has a section sandwiched between the base and the seat, and another section thereof stretching along the base from said section to a portion of the base in no attachment with the seat.

    摘要翻译: 一种散热装置,包括一个座和一个具有与第一面相对的第一面和第二面的底座,并且与基座热接触。 多个翼片从基座的第一面延伸。 两个热管被热布置在基座的第二面上。 两个热管中的每一个被弯曲并且具有夹在基座和座之间的部分,而另一部分沿基座从所述部分延伸到基座的一部分,而不与座接合。

    Heat sink
    6.
    发明授权
    Heat sink 失效
    散热器

    公开(公告)号:US07174955B2

    公开(公告)日:2007-02-13

    申请号:US11018070

    申请日:2004-12-20

    IPC分类号: F28F7/00 F28D15/00

    摘要: A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides thereof. The shortened flanges extend from the body in an opposite direction to the elongated flange with the elongated flange located therebetween. The elongated flange (14) defines two holes (142) at respective opposite sides thereof and each shortened flange (16) provides an engaging piece (164) in alignment with one hole of the elongated flange. The engaging pieces of one fin engage in corresponding holes of an adjacent fin to thereby combine the fins together.

    摘要翻译: 散热片(10)包括彼此连接的多个翅片(12)。 在一个实施例中,每个翅片包括具有细长凸缘(14)的主体(13)和从其两个相对侧中的每一个延伸的两个缩短的凸缘(16)。 缩短的凸缘从主体向与细长凸缘相反的方向延伸,并且细长凸缘位于它们之间。 细长法兰(14)在其各自的相对侧限定两个孔(142),并且每个缩短的凸缘(16)提供与细长法兰的一个孔对准的接合件(164)。 一个翅片的接合片接合相邻翅片的相应的孔,从而将翅片组合在一起。

    Cooling fin assembly
    7.
    发明授权
    Cooling fin assembly 失效
    散热片组件

    公开(公告)号:US07163049B2

    公开(公告)日:2007-01-16

    申请号:US11018290

    申请日:2004-12-20

    IPC分类号: F28F7/00 H05K7/20

    摘要: A cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Each of the engaging members includes a roll piece (15a) with an elongated hole (16a) defined therein and a connecting piece (17a) with an engaging piece (18a) extending therefrom. In assembly of the cooling fins, the engaging pieces of each of the cooling fins engage in the corresponding holes of the roll pieces of an adjacent cooling fin to thereby fasten and join the cooling fins with one another.

    摘要翻译: 冷却翅片组件(10)包括连接在一起的多个冷却翅片(10a)。 每个冷却翅片包括分别在其四个角处形成四个接合构件(14a)的主体(11a)。 每个接合构件包括具有限定在其中的细长孔(16a)的辊片(15A)和具有从其延伸的接合件(18a)的连接件(17a)。 在冷却翅片的组装中,每个冷却翅片的接合件与相邻冷却翅片的辊片的相应的孔接合,从而将冷却翅片彼此紧固并连接。

    Heat sink
    8.
    发明授权
    Heat sink 失效
    散热器

    公开(公告)号:US07343962B2

    公开(公告)日:2008-03-18

    申请号:US11308862

    申请日:2006-05-16

    IPC分类号: H05K7/20

    摘要: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

    摘要翻译: 用于从电子部件散热的散热器包括散热器和设置在其上的多个第一散热片和第二散热片。 第一和第二散热片彼此平行并且以交替的顺序布置以便限定多个空气通道。 第一和第二散热片设置成使得沿着空气通道的延伸方向在中间更薄的空气通道和更密集的翅片分布,并且提供了更宽的空气通道,并且在两端具有较低的翅片分布密度。

    Heat sink for a portable computer
    9.
    发明授权
    Heat sink for a portable computer 失效
    散热器为便携式电脑

    公开(公告)号:US07321491B2

    公开(公告)日:2008-01-22

    申请号:US11308273

    申请日:2006-03-15

    IPC分类号: H05K7/20 F28D15/00 H01B7/42

    摘要: A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe (220) transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

    摘要翻译: 用于便携式计算机(100)的散热器(200)包括位于便携式计算机外部的多个翅片(210),延伸到便携式计算机的内部空间中的导电板(230),用于吸收便携式计算机 ,以及将由导电板吸收的热量传递到翅片的热管(220)。 因此,便携式计算机中的热量由散热器从便携式计算机的内部空间移除。

    Heat sink assembly
    10.
    发明申请
    Heat sink assembly 失效
    散热器组件

    公开(公告)号:US20070097631A1

    公开(公告)日:2007-05-03

    申请号:US11265344

    申请日:2005-11-02

    IPC分类号: H05K7/20

    摘要: A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardly extending to engage in the slot, and a fastening lug (28) secured to a recessed portion (122) of a top surface of a base (12) of the heat sink. The fastening lug extending from a baffle (24) which fittingly engages with a raised portion (124) of the top surface of the base adjacent to the recessed portion.

    摘要翻译: 散热器组件包括散热器(10),安装在散热器上的风扇支架(20)和由风扇支架承载的风扇(30)。 散热器在其顶部限定一个槽(148)。 风扇架包括向下延伸以接合在槽中的挡板(260)和固定到散热器的底座(12)的顶表面的凹部(122)的紧固凸耳(28)。 所述紧固凸耳从与所述凹部相邻的所述基部的顶表面的凸起部分(124)适配地接合的挡板(24)延伸。