INDIUM ZINC OXIDE BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND INDIUM ZINC OXIDE BASED THIN FILM
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    发明申请
    INDIUM ZINC OXIDE BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND INDIUM ZINC OXIDE BASED THIN FILM 审中-公开
    基于氧化锌的氧化铟基溅射靶,其制造方法和基于氧化锌的薄膜

    公开(公告)号:US20090211903A1

    公开(公告)日:2009-08-27

    申请号:US12392457

    申请日:2009-02-25

    IPC分类号: C23C14/00 B29C43/02

    CPC分类号: C23C14/3414 C23C14/08

    摘要: Disclosed are an indium (In) zinc (Zn) oxide based sputtering target, a method of manufacturing the same, and an In Zn oxide based thin film deposited using the In Zn oxide based sputtering target. The In Zn oxide based sputtering target has a composition of (MO2)x(In2O3)y(ZnO)z, in which x:y is about 1:0.01 to 1:1, y:z is about 1:0.1 to 1:10, and M is at least one metal selected from a group consisting of hafnium (Hf), zirconium (Zr), and titanium (Ti).

    摘要翻译: 公开了一种铟(In)锌(Zn)氧化物基溅射靶,其制造方法和使用In Zn氧化物基溅射靶沉积的In-Zn氧化物基薄膜。 In Zn氧化物基溅射靶具有(MO 2)x(In 2 O 3)y(ZnO)z的组成,其中x:y为约1:0.01至1:1,y:z为约1:0.1至1:1。 10,M是选自铪(Hf),锆(Zr)和钛(Ti)中的至少一种金属。