公开(公告)号：US09324679B2

公开(公告)日：2016-04-26

申请号：US13587101

申请日：2012-08-16

申请人： Yoshihide Ishii ,  Masayuki Mochizuki ,  Yoshihiro Kurihara

发明人： Yoshihide Ishii ,  Masayuki Mochizuki ,  Yoshihiro Kurihara

IPC分类号： B29C65/48 ,  H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/75702

摘要： A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.

摘要翻译： 双轴驱动机构包括处理单元，设置有第一可动部的第一线性马达和第一固定部，第一线性马达沿着第一线性引导件升高处理单元，第二线性马达设置有第二可动部， 第二固定部分，其沿垂直于用于升高处理单元的方向的水平方向移动处理单元;固定第一固定部分的支撑体;设置在支撑体和第二固定部分之间的第二线性引导件 并且允许第二固定部分自由移动;以及控制单元，其基于线性传感器的输出控制第一可移动部分在水平方向上的位置，该线性传感器的输出检测第一可移动部分在水平方向上的位置， 尊重支持机构。

公开(公告)号：US08460491B1

公开(公告)日：2013-06-11

申请号：US13414236

申请日：2012-03-07

申请人： Shingo Fukasawa ,  Tatsuyuki Okubo ,  Yoshihiro Kurihara

发明人： Shingo Fukasawa ,  Tatsuyuki Okubo ,  Yoshihiro Kurihara

IPC分类号： B32B41/00

CPC分类号： H01L21/67144 ,  Y10T156/1705

摘要： The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained.In a die bonder or a bonding method in which a bonding head is ascended/descended by a first ascending/descending drive shaft unit, a die is picked up, the picked-up die is installed onto a workpiece, and after installed, a load is exerted on the die by the bonding head to bond the die to the workpiece, whether the load is higher/lower than a predetermined load is determined, and in bonding, when the load is higher than the predetermined load, the high load is exerted by the first ascending/descending drive shaft unit, and when the load is lower than the predetermined load, the low load is exerted by a second ascending/descending drive shaft unit.

摘要翻译： 本发明提供了从高负载到低负载的接合负载或高速安装的管芯接合器和接合方法。 在通过第一上升/下降驱动轴单元上升/下降接合头的芯片接合机或接合方法中，拾取模具，将拾取的模具安装在工件上，并且在安装后， 通过接合头施加在模具上，将模具结合到工件，无论负载是否高于/低于预定负载，并且在接合中，当负载高于预定负载时，施加高负载 通过第一上升/下降驱动轴单元，并且当负载低于预定负载时，通过第二上升/下降驱动轴单元施加低负载。