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    Fluid moving device with low-drag impellers
    2.
    发明申请
    Fluid moving device with low-drag impellers 审中-公开
    具有低阻力叶轮的流体移动装置

    公开(公告)号：US20070059176A1

    公开(公告)日：2007-03-15

    申请号：US11226970

    申请日：2005-09-15

    申请人： Bret Lehman ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

    发明人： Bret Lehman ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

    IPC分类号： B64C11/06

    CPC分类号： G06F1/20

    摘要： A cooling system for cooling a device in a computer system includes a plurality of cooling fans positioned in series. Each cooling fan includes a hub and at least one fan blade connected to the hub. The fan blade rotates relative to the hub about a substantially radially extending axis and between at least a first position and a second position. Drag to a flow of fluid through the cooling system by the fan blade in the second position is less than drag to the flow of fluid through the cooling system by the fan blade in the first position. Upon the hub rotating within the cooling fan, the fan blade is in the first position, and upon the hub stationary within the cooling fan, the fan blade is in the second position. The cooling system also includes a biasing member connected to the fan blade and the hub that biases the fan blade towards the second position.

    摘要翻译： 用于冷却计算机系统中的装置的冷却系统包括串联定位的多个冷却风扇。 每个冷却风扇包括轮毂和连接到轮毂的至少一个风扇叶片。 风扇叶片围绕基本上径向延伸的轴线并且在至少第一位置和第二位置之间相对于轮毂旋转。 通过风扇叶片在第二位置的流动通过冷却系统的流动小于通过风扇叶片处于第一位置的通过冷却系统的流体流的阻力。 当轮毂在冷却风扇内旋转时，风扇叶片处于第一位置，并且当毂在冷却风扇内固定时，风扇叶片处于第二位置。 冷却系统还包括连接到风扇叶片和毂的偏置构件，其将风扇叶片朝向第二位置偏置。

    Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
    3.
    发明申请
    Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component 失效
    冷板装置及其制造方法，在冶金结合的管和散热器之间具有受控的传热特性，以便于电子部件的冷却

    公开(公告)号：US20070017658A1

    公开(公告)日：2007-01-25

    申请号：US11184654

    申请日：2005-07-19

    申请人： Bret Lehman ,  Roger Schmidt ,  Prabjit Singh

    发明人： Bret Lehman ,  Roger Schmidt ,  Prabjit Singh

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20254 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49364 ,  Y10T29/49368 ,  Y10T29/49369 ,  Y10T29/49373 ,  Y10T29/49377 ,  Y10T29/49393

    摘要： Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.

    摘要翻译： 提供冷板装置和制造方法以便于电子部件的冷却。 制造方法包括：形成具有第一金属的管，并且具有设置在其间的传热区域的第一和第二端; 将管的传热区域定位在模具内，并通过使熔融形式的第二金属接触在管上而使管子周围的散热构件铸造，其中第一和第二金属在管道之间进行反应以在管和管之间形成合金层 并且通过冷却熔融的第二金属，在管和散热部件之间形成冶金结合部; 并且控制散热构件的铸造以最小化合金层的厚度，以增强在管和散热构件之间形成的冶金结合的传热特性。