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    Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
    1.
    发明申请
    Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component 失效
    冷板装置及其制造方法，在冶金结合的管和散热器之间具有受控的传热特性，以便于电子部件的冷却

    公开(公告)号：US20070017658A1

    公开(公告)日：2007-01-25

    申请号：US11184654

    申请日：2005-07-19

    申请人： Bret Lehman ,  Roger Schmidt ,  Prabjit Singh

    发明人： Bret Lehman ,  Roger Schmidt ,  Prabjit Singh

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20254 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49364 ,  Y10T29/49368 ,  Y10T29/49369 ,  Y10T29/49373 ,  Y10T29/49377 ,  Y10T29/49393

    摘要： Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.

    摘要翻译： 提供冷板装置和制造方法以便于电子部件的冷却。 制造方法包括：形成具有第一金属的管，并且具有设置在其间的传热区域的第一和第二端; 将管的传热区域定位在模具内，并通过使熔融形式的第二金属接触在管上而使管子周围的散热构件铸造，其中第一和第二金属在管道之间进行反应以在管和管之间形成合金层 并且通过冷却熔融的第二金属，在管和散热部件之间形成冶金结合部; 并且控制散热构件的铸造以最小化合金层的厚度，以增强在管和散热构件之间形成的冶金结合的传热特性。

    Thermal interface apparatus
    4.
    发明申请
    Thermal interface apparatus 有权
    热接口设备

    公开(公告)号：US20070177367A1

    公开(公告)日：2007-08-02

    申请号：US11344657

    申请日：2006-02-01

    申请人： Sean Bailey ,  Richard Blanco ,  David Edwards ,  Supratik Guha ,  Michael Hillman ,  Yves Martin ,  Phillip Mort ,  Roger Schmidt ,  Prabjit Singh ,  Ronald Smith ,  Gregory Tice ,  Theodore van Kessel

    发明人： Sean Bailey ,  Richard Blanco ,  David Edwards ,  Supratik Guha ,  Michael Hillman ,  Yves Martin ,  Phillip Mort ,  Roger Schmidt ,  Prabjit Singh ,  Ronald Smith ,  Gregory Tice ,  Theodore van Kessel

    IPC分类号： H05K7/12

    CPC分类号： H01L23/42 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

    摘要翻译： 一种用于将热量从计算机部件传导到散热器的装置。 本发明可以包括热界面材料（TIM）。 本发明还可以包括至少部分地包围TIM的密封件或垫圈。 垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。 通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。 插入件可以放置在垫圈内并且限定孔。 芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。 干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

    Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
    5.
    发明申请
    Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins 失效
    冷却装置，冷却电子模块及其制造方法采用导热的引线引脚散热片

    公开(公告)号：US20060126308A1

    公开(公告)日：2006-06-15

    申请号：US11009935

    申请日：2004-12-10

    申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

    发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3677 ,  F28F3/022 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/78301 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

    摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

    Method and apparatus for sealing a liquid cooled electronic device
    6.
    发明申请
    Method and apparatus for sealing a liquid cooled electronic device 有权
    密封液体冷却电子设备的方法和装置

    公开(公告)号：US20050248921A1

    公开(公告)日：2005-11-10

    申请号：US10842594

    申请日：2004-05-10

    申请人： Roger Schmidt ,  Prabjit Singh

    发明人： Roger Schmidt ,  Prabjit Singh

    IPC分类号： H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/473 ,  H01L2224/16225 ,  H01L2924/09701

    摘要： A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate, an electronic device electrically connected to the substrate, and an elastomer barrier. The barrier includes a cutout configured to sealably affix to chip edges defining the electronic device. The cutout provides fluid communication to a back surface of the electronic device exposed through the cutout while the barrier seals the substrate from such fluid communication.

    摘要翻译： 公开了一种用于液体冷却电子设备的方法和装置，而不会湿润电子设备的下侧硬件和与其连接的基板。 在示例性实施例中，电子模块衬底组件包括衬底，电连接到衬底的电子器件和弹性体屏障。 屏障包括被配置为可密封地固定到限定电子设备的芯片边缘的切口。 切口提供流体连通到通过切口暴露的电子设备的后表面，同时屏障将基板从这种流体连通中密封。

    System and method for detecting gas leaks
    7.
    发明授权
    System and method for detecting gas leaks 有权
    气体泄漏检测系统及方法

    公开(公告)号：US07939804B2

    公开(公告)日：2011-05-10

    申请号：US12324649

    申请日：2008-11-26

    申请人： Roger Schmidt

    发明人： Roger Schmidt

    IPC分类号： G01N21/00

    CPC分类号： G01M3/38 ,  G01N21/3504

    摘要： A gas detection system is disclosed that uses an infrared illumination source and an infrared imaging detector. The infrared source is selected to emit at wavelengths corresponding to an absorption band of a gas to be detected. The region to be analyzed for the gas is illuminated, and the infrared radiation reflects off of local surfaces back to the imaging detector. At locations where the gas is present, the infrared radiation is absorbed which reduces the back reflection to the detector.

    摘要翻译： 公开了一种使用红外照明源和红外成像检测器的气体检测系统。 选择红外源以与要检测的气体的吸收带相对应的波长发射。 要分析气体的区域被照亮，并且红外辐射从局部表面反射回到成像检测器。 在存在气体的位置，吸收红外线辐射，这减少了对检测器的反射。

    Bidirectional and expandable heat flow measurement tool for units of air cooled electrical equipment
    8.
    发明授权
    Bidirectional and expandable heat flow measurement tool for units of air cooled electrical equipment 有权
    空气冷却电气设备单元的双向和可扩展热流测量工具

    公开(公告)号：US07854547B2

    公开(公告)日：2010-12-21

    申请号：US11834752

    申请日：2007-08-07

    申请人： Alan Claassen ,  Dennis Hansen ,  Cary Huettner ,  Madhusudan Iyengar ,  Roger Schmidt ,  Kenneth Schneebeli ,  Gerard Weber, Jr.

    发明人： Alan Claassen ,  Dennis Hansen ,  Cary Huettner ,  Madhusudan Iyengar ,  Roger Schmidt ,  Kenneth Schneebeli ,  Gerard Weber, Jr.

    IPC分类号： G01K1/14 ,  G01K1/16 ,  G01K13/02 ,  G01N25/20

    CPC分类号： G01K13/02 ,  G01F1/46

    摘要： A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool.

    摘要翻译： 公开了一种用于测量电子设备单元的重要热特性的工具，其获得在该单元的空气入口和空气出口开口处的空气流量和温度读数，而不会干扰电缆或接线连接或以其他方式中断设备操作。 工具压力感测元件可在止动位置之间旋转，以允许工具在空气入口和出气口两端使用。 工具空气管道部分可以由分离的管道部分形成，以使得包括感测装置的单个管道部分能够与符合电子设备空气入口和出口开口的多个管道部分一起使用以赋予工具更多的灵活性。

    SYSTEM AND METHOD FOR DETECTING GAS LEAKS
    9.
    发明申请
    SYSTEM AND METHOD FOR DETECTING GAS LEAKS 有权
    用于检测气体泄漏的系统和方法

    公开(公告)号：US20100127173A1

    公开(公告)日：2010-05-27

    申请号：US12324649

    申请日：2008-11-26

    申请人： Roger Schmidt

    发明人： Roger Schmidt

    IPC分类号： G01N21/00

    CPC分类号： G01M3/38 ,  G01N21/3504

    摘要： A gas detection system is disclosed that uses an infrared illumination source and an infrared imaging detector. The infrared source is selected to emit at wavelengths corresponding to an absorption band of a gas to be detected. The region to be analyzed for the gas is illuminated, and the infrared radiation reflects off of local surfaces back to the imaging detector. At locations where the gas is present, the infrared radiation is absorbed which reduces the back reflection to the detector.

    摘要翻译： 公开了一种使用红外照明源和红外成像检测器的气体检测系统。 选择红外源以与要检测的气体的吸收带相对应的波长发射。 要分析气体的区域被照亮，并且红外辐射从局部表面反射回到成像检测器。 在存在气体的位置，吸收红外线辐射，这减少了对检测器的反射。

    RADIOMETER AND TEMPERATURE COMPENSATION SYSTEM
    10.
    发明申请
    RADIOMETER AND TEMPERATURE COMPENSATION SYSTEM 审中-公开
    放射性和温度补偿系统

    公开(公告)号：US20090262012A1

    公开(公告)日：2009-10-22

    申请号：US12103854

    申请日：2008-04-16

    申请人： Paul Carlson ,  Samir Jain ,  Jill Ryan ,  Jeffrey Elrod ,  Roger Schmidt ,  Larry Wilson ,  Medwin Schreher

    发明人： Paul Carlson ,  Samir Jain ,  Jill Ryan ,  Jeffrey Elrod ,  Roger Schmidt ,  Larry Wilson ,  Medwin Schreher

    IPC分类号： G01S3/02 ,  G01S13/00 ,  G06K7/10

    CPC分类号： G01J5/0003 ,  G01J5/0265 ,  G01J5/089 ,  G01J2005/0077

    摘要： A radiometer for measuring temperature data can include a data reader for reading target data associated with a measurement target and generating temperature data based on the target data. A temperature compensation system can include a radiometer with a data reader and one or more data tags placed proximate corresponding measurement targets. The data tags can contain target data including a target identifier and/or compensation data, among other data. The compensation data can include, for example, a target emissivity. In some embodiments the data reader can include an optical scanning device and/or an RFID reader.

    摘要翻译： 用于测量温度数据的辐射计可以包括用于读取与测量目标相关联的目标数据并基于目标数据产生温度数据的数据读取器。 温度补偿系统可以包括具有数据读取器的辐射计和放置在相应测量目标附近的一个或多个数据标签。 数据标签可以包含目标数据，包括目标标识符和/或补偿数据，以及其他数据。 补偿数据可以包括例如目标发射率。 在一些实施例中，数据读取器可以包括光学扫描装置和/或RFID读取器。