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公开(公告)号：US6077437A
公开(公告)日：2000-06-20
申请号：US950394
申请日：1997-10-14
IPC分类号： B24B1/00 , B01D61/14 , B01D61/16 , B01D61/22 , B24B37/00 , B24B57/00 , C02F1/44 , H01L21/304 , B01D61/00
摘要： A polishing agent recovery and reuse method and device for the same removes large impurities by a filtration device, concentrates by an ultrafiltration device, and continuously recovers polishing agent. Polishing agent used in polishing a semiconductor board or a coating formed on top of a semiconductor board is collected in a pre-processing container after use. Large impurities are removed by a dual fine filtration device. The resulting filtrate is concentrated by an ultrafiltration device. The concentrated solution may then be mixed with filtrate from the dual fine filtration device to further concentrate the polishing agent. The concentration of the polishing agent in the concentrated solution, the pH, and the temperature of the solution are continuously monitored and controlled. The filtrate of the ultrafiltration device is further treated to remove impurities, resulting in pure or ultrapure water. The recovered polishing agent may be reused in further polishing steps.
摘要翻译： 抛光剂回收和再利用方法及其装置通过过滤装置除去大量杂质，通过超滤装置浓缩，并连续回收抛光剂。 在半导体基板的研磨中使用的抛光剂或在半导体基板的顶部形成的涂层在使用后收集在预处理容器中。 通过双重精细过滤装置除去大量杂质。 所得滤液通过超滤装置浓缩。 然后将浓缩的溶液与来自双精细过滤装置的滤液混合，以进一步浓缩抛光剂。 浓缩溶液中的研磨剂浓度，pH值和溶液的温度被连续监测和控制。 进一步处理超滤装置的滤液以除去杂质，得到纯净或超纯水。 回收的抛光剂可以再次用于进一步的抛光步骤。
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公开(公告)号：US07018529B2
公开(公告)日：2006-03-28
申请号：US10792831
申请日：2004-03-05
CPC分类号： C02F9/00 , A61L2/186 , C02F1/32 , C02F1/42 , C02F1/44 , C02F1/441 , C02F1/444 , C02F1/722 , C02F2103/04 , C02F2301/043 , Y10S210/90
摘要： The ultrapure water producing system produces ultrapure water with high purity and remarkably low content of metals even just after restart of operation thereof. Water sent through the pump 3 or 4 into a line 8 flows through a heat exchanger 10, a line 12, a UV oxidation apparatus 20, a line 22, an ion exchange device 30, a line 32 and a membrane filtering device 40 and is treated in each device in this order to be ultrapure water. The devices 10, 20, 30, 40 have bypass lines 11, 21, 31, 41, respectively. In the sterilizing process, bactericide water is fed only to the membrane filtering device 40 via the bypass lines 11, 21 and 31. In the following sterilizing process of the heat exchanger 10 and the UV oxidation apparatus 20, the bactericide water flows the line 41 bypassing around the membrane filtering device 40.
摘要翻译： 超纯水生产系统即使刚开始运转，也能生产出纯度高，金属含量非常低的超纯水。 通过泵3或4送入管线8的水通过热交换器10，管线12，UV氧化装置20，管线22，离子交换装置30，管线32和膜过滤装置40，并且是 在每个装置中按此顺序处理为超纯水。 装置10,20,30,40分别具有旁路管线11,21,31,41。 在灭菌过程中，杀菌剂水经由旁路管线11,21,31仅供给膜过滤装置40。 在热交换器10和UV氧化装置20的以下消毒处理中，杀菌剂水流过围绕膜过滤装置40旁通的管线41。
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