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1.发明授权公开(公告)号：US08710524B2
公开(公告)日：2014-04-29
申请号：US12529984
申请日：2008-03-05
IPC分类号： H01L33/00
CPC分类号： H01L33/10 , H01L33/54 , H01L33/58 , H01L2933/0091
摘要： Fine asperities are simply formed in the surface of a light emission surface to improve an luminous efficiency of a light emitting element. An LED element 10 is prepared as an example of a luminous body, and a thermally deformable heat mode recording material layer 12 is formed in the light emission surface 18 of the LED element 10. The recording material layer 12 is then illuminated with condensed light so that a plurality of recessed portions 15 are formed at a pitch of 0.01-100 times a center wavelength of the light emitted from the LED element 10.
摘要翻译： 在发光面的表面简单地形成微细的凹凸，以提高发光元件的发光效率。 准备LED元件10作为发光体的实例，并且在LED元件10的发光表面18中形成可热变形的热模式记录材料层12.然后，记录材料层12被聚光照射，因此 多个凹部15以从LED元件10发射的光的中心波长的0.01-100倍的间距形成。
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2.发明申请公开(公告)号：US20100090236A1
公开(公告)日：2010-04-15
申请号：US12529984
申请日：2007-03-05
IPC分类号： H01L33/00
CPC分类号： H01L33/10 , H01L33/54 , H01L33/58 , H01L2933/0091
摘要： Fine asperities are simply formed in the surface of a light emission surface to improve an luminous efficiency of a light emitting element. An LED element 10 is prepared as an example of a luminous body, and a thermally deformable heat mode recording material layer 12 is formed in the light emission surface 18 of the LED element 10. The recording material layer 12 is then illuminated with condensed light so that a plurality of recessed portions 15 are formed at a pitch of 0.01-100 times a center wavelength of the light emitted from the LED element 10.
摘要翻译： 在发光面的表面简单地形成微细的凹凸，以提高发光元件的发光效率。 准备LED元件10作为发光体的实例，并且在LED元件10的发光表面18中形成可热变形的热模式记录材料层12.然后，记录材料层12被聚光照射，因此 多个凹部15以从LED元件10发射的光的中心波长的0.01-100倍的间距形成。
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