公开(公告)号：US20100061718A1

公开(公告)日：2010-03-11

申请号：US12620313

申请日：2009-11-17

申请人： Yoshitaka Hara ,  Shingo Katsuki

发明人： Yoshitaka Hara ,  Shingo Katsuki

IPC分类号： G03D5/00 ,  G03B27/32

CPC分类号： H01L21/67225 ,  G03F7/70525 ,  G03F7/7075 ,  G03F7/70808 ,  H01L21/6715 ,  H01L21/67745 ,  Y10S414/14

摘要： Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1. The processing block loading conveyance element 12 conveys the substrates W, one at a time, from the carrier C to each resist-film forming block G2, G3, sequentially and periodically, and the exposure apparatus loading conveyance element I loads the substrates W from each resist-film forming block G2, G3 into the exposure apparatus S4 in the sequence that each has been conveyed to the resist-film forming block G2, G3 by the processing block loading conveyance element 12.

摘要翻译： 这里公开了可以抑制基板输送精度降低的涂布显影装置1。 涂布显影装置1的处理块S2包括多个抗蚀剂膜形成块G2，G3和显影块G1。 提供了用于将衬底装载到处理块S2中的传送元件12，用于将衬底W从载体C传送到抗蚀剂膜形成块G2，G3。 此外，在接口块S3中设置用于将曝光装置S4中的基板载置的输送元件I，将基板W装载到曝光装置S4中，在从曝光装置S4取出基板W之后，将基板W输送到显影 块G1。 处理块装载传送元件12依次和周期地将基板W一次一个地从载体C传送到每个抗蚀剂膜形成块G2，G3，并且曝光装置装载传送元件I从每个基板W装载基板W 抗蚀剂膜形成块G2，G3以通过处理块装载传送元件12被传送到抗蚀剂膜形成块G2，G3的顺序进入曝光装置S4。

公开(公告)号：US07934880B2

公开(公告)日：2011-05-03

申请号：US12620313

申请日：2009-11-17

申请人： Yoshitaka Hara ,  Shingo Katsuki

发明人： Yoshitaka Hara ,  Shingo Katsuki

IPC分类号： G03D5/00 ,  G03B27/32 ,  B65H11/00 ,  B05C13/00

CPC分类号： H01L21/67225 ,  G03F7/70525 ,  G03F7/7075 ,  G03F7/70808 ,  H01L21/6715 ,  H01L21/67745 ,  Y10S414/14

摘要： Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1. The processing block loading conveyance element 12 conveys the substrates W, one at a time, from the carrier C to each resist-film forming block G2, G3, sequentially and periodically, and the exposure apparatus loading conveyance element I loads the substrates W from each resist-film forming block G2, G3 into the exposure apparatus S4 in the sequence that each has been conveyed to the resist-film forming block G2, G3 by the processing block loading conveyance element 12.

摘要翻译： 这里公开了可以抑制基板输送精度降低的涂布显影装置1。 涂布显影装置1的处理块S2包括多个抗蚀剂膜形成块G2，G3和显影块G1。 提供了用于将衬底装载到处理块S2中的传送元件12，用于将衬底W从载体C传送到抗蚀剂膜形成块G2，G3。 此外，在接口块S3中设置用于将曝光装置S4中的基板载置的输送元件I，将基板W装载到曝光装置S4中，在从曝光装置S4取出基板W之后，将基板W输送到显影 块G1。 处理块装载传送元件12依次和周期地将基板W一次一个地从载体C传送到每个抗蚀剂膜形成块G2，G3，并且曝光装置装载传送元件I从每个基板W装载基板W 抗蚀剂膜形成块G2，G3以通过处理块装载传送元件12被传送到抗蚀剂膜形成块G2，G3的顺序进入曝光装置S4。

公开(公告)号：US20090059187A1

公开(公告)日：2009-03-05

申请号：US12197682

申请日：2008-08-25

申请人： Yoshitaka Hara ,  Shingo Katsuki

发明人： Yoshitaka Hara ,  Shingo Katsuki

IPC分类号： G03B27/32 ,  G03D5/00

CPC分类号： H01L21/67225 ,  G03F7/70525 ,  G03F7/7075 ,  G03F7/70808 ,  H01L21/6715 ,  H01L21/67745 ,  Y10S414/14

摘要： Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1. The processing block loading conveyance element 12 conveys the substrates W, one at a time, from the carrier C to each resist-film forming block G2, G3, sequentially and periodically, and the exposure apparatus loading conveyance element I loads the substrates W from each resist-film forming block G2, G3 into the exposure apparatus S4 in the sequence that each has been conveyed to the resist-film forming block G2, G3 by the processing block loading conveyance element 12.

摘要翻译： 这里公开了可以抑制基板输送精度降低的涂布显影装置1。 涂布显影装置1的处理块S2包括多个抗蚀剂膜形成块G2，G3和显影块G1。 提供了用于将衬底装载到处理块S2中的传送元件12，用于将衬底W从载体C传送到抗蚀剂膜形成块G2，G3。 此外，在接口块S3中设置用于将曝光装置S4中的基板载置的输送元件I，将基板W装载到曝光装置S4中，在从曝光装置S4取出基板W之后，将基板W输送到显影 块G1。 处理块装载传送元件12依次和周期地将基板W一次一个地从载体C传送到每个抗蚀剂膜形成块G2，G3，并且曝光装置装载传送元件I从每个基板W装载基板W 抗蚀剂膜形成块G2，G3以通过处理块装载传送元件12被传送到抗蚀剂膜形成块G2，G3的顺序进入曝光装置S4。

公开(公告)号：US07645081B2

公开(公告)日：2010-01-12

申请号：US12197682

申请日：2008-08-25

申请人： Yoshitaka Hara ,  Shingo Katsuki

发明人： Yoshitaka Hara ,  Shingo Katsuki

IPC分类号： G03D5/00 ,  G03B27/32 ,  B65H11/00 ,  B05C13/00

CPC分类号： H01L21/67225 ,  G03F7/70525 ,  G03F7/7075 ,  G03F7/70808 ,  H01L21/6715 ,  H01L21/67745 ,  Y10S414/14

摘要： Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1. The processing block loading conveyance element 12 conveys the substrates W, one at a time, from the carrier C to each resist-film forming block G2, G3, sequentially and periodically, and the exposure apparatus loading conveyance element I loads the substrates W from each resist-film forming block G2, G3 into the exposure apparatus S4 in the sequence that each has been conveyed to the resist-film forming block G2, G3 by the processing block loading conveyance element 12.

摘要翻译： 这里公开了可以抑制基板输送精度降低的涂布显影装置1。 涂布显影装置1的处理块S2包括多个抗蚀剂膜形成块G2，G3和显影块G1。 提供了用于将衬底装载到处理块S2中的传送元件12，用于将衬底W从载体C传送到抗蚀剂膜形成块G2，G3。 此外，在接口块S3中设置用于将曝光装置S4中的基板载置的输送元件I，将基板W装载到曝光装置S4中，在从曝光装置S4取出基板W之后，将基板W输送到显影 块G1。 处理块装载传送元件12依次和周期地将基板W一次一个地从载体C传送到每个抗蚀剂膜形成块G2，G3，并且曝光装置装载传送元件I从每个基板W装载基板W 抗蚀剂膜形成块G2，G3以通过处理块装载传送元件12被传送到抗蚀剂膜形成块G2，G3的顺序进入曝光装置S4。