摘要:
Provided is a method for controlling and driving constituent elements of an external device connected to user equipment. The method may include obtaining external device information from the external device when coupled to the user equipment, obtaining application information based on the obtained external device information, and running an application tailored for the external device based on the obtained application information.
摘要:
Provided is a method for controlling and driving constituent elements of an external device connected to user equipment. The method may include obtaining external device information from the external device when coupled to the user equipment, obtaining application information based on the obtained external device information, and running an application tailored for the external device based on the obtained application information.
摘要:
Provided are user equipment connectable to an external device and a method for establishing a connection between user equipment including second constituent elements and an external device including first constituent elements and controlling the external device. The method may include sensing the connection to the external device, obtaining first constituent element information from the external device through the connection, wherein the first constituent element information includes information on first constituent elements of the external device, selecting target constituent elements to control from the first constituent elements of the external device based on the obtained first constituent element information, reconfiguring a control path for controlling the selected target constituent elements of the external device, and controlling the selected target constituent elements of the external device through the reconfigured control path.
摘要:
Provided are user equipment connectable to an external device and a method for establishing a connection between user equipment including second constituent elements and an external device including first constituent elements and controlling the external device. The method may include sensing the connection to the external device, obtaining first constituent element information from the external device through the connection, wherein the first constituent element information includes information on first constituent elements of the external device, selecting target constituent elements to control from the first constituent elements of the external device based on the obtained first constituent element information, reconfiguring a control path for controlling the selected target constituent elements of the external device, and controlling the selected target constituent elements of the external device through the reconfigured control path.
摘要:
Provided is a method for controlling user equipment as a touch pad for an external device connected to the user equipment. An operation mode may be changed to a pointing device operation mode when the user equipment is coupled to the external device. In the pointing device operation mode, a touch input may be received through a touch screen panel of the user equipment. A pointer may be displayed on a display unit of the external device corresponding to a coordinate value of the touch input made on the touch screen panel. An operation associated with the received touch input may be performed in the user equipment.
摘要:
The present invention relates to a pre-fabricated sidewalk block having a heating wire, which may effectively transmit heat through the upper portion of the sidewalk block without losing heat radiated from the heating wire to the ground; which may be easily assembled; and which may absorb the impact of walking. The pre-fabricated sidewalk having the heating wire includes: a lower block having a plurality of first groove parts in the top surface thereof; a buffer plate having a plurality of second groove parts protruding downward so that the plurality of groove parts are inserted and coupled into the first groove parts of the lower block, and which has a first heating wire insertion groove in the length direction in the top surface between the second groove parts which are adjacent to each other; an upper block having a plurality of protrusion parts protruding downward so that the bottom surface thereof is inserted and coupled to the second groove parts of the buffer plate, and which has a second heating wire insertion groove corresponding to the first heating wire insertion groove in the bottom surface between the protrusions which are adjacent to each other; and a heating wire inserted between the first heating wire insertion groove and the second heating wire insertion groove.
摘要:
There is provided a method of depositing a Ge—Sb—Te thin film, including: a Ge—Sb—Te thin-film forming step of feeding and purging a first precursor including any one of Ge, Sb and Te, a second precursor including another one of Ge, Sb and Te and a third precursor including the other one of Ge, Sb and Te into and from a chamber in which a wafer is mounted and forming the Ge—Sb—Te thin film on the wafer; and a reaction gas feeding step of feeding reaction gas while any one of the first to third precursors is fed.
摘要:
There is provided a method of depositing a Ge—Sb—Te thin film, including: a Ge—Sb—Te thin-film forming step of feeding and purging a first precursor including any one of Ge, Sb and Te, a second precursor including another one of Ge, Sb and Te and a third precursor including the other one of Ge, Sb and Te into and from a chamber in which a wafer is mounted and forming the Ge—Sb—Te thin film on the wafer; and a reaction gas feeding step of feeding reaction gas while any one of the first to third precursors is fed.
摘要:
The present invention concerns a method of forming a chalcogenide thin film for a phase-change memory. In the method of forming a chalcogenide thin film according to the present invention, a substrate with a pattern formed is loaded into a reactor, and a source gas is supplied onto the substrate. Here, the source gas includes at least one source gas selected from germanium (Ge) source gas, gallium (Ga) source gas, indium (In) source gas, selenium (Se) source gas, antimony (Sb) source gas, tellurium (Te) source gas, tin (Sn) source gas, silver (Ag) source gas, and sulfur (S) source gas. A first purge gas is supplied onto the substrate in order to purge the source gas supplied onto the substrate, a reaction gas for reducing the source gas is then supplied onto the substrate, and a second purge gas is supplied onto the substrate in order to purge the reaction gas supplied onto the substrate. At least one operation, namely changing the supply time of the first purge gas and/or adjusting the internal pressure of the reactor is performed in such a way as to ensure that the deposition rate at an inner portion of the pattern is greater than the deposition rate at an upper portion of the pattern. According to the present invention, it is possible to form a chalcogenide thin film having an excellent gap-fill property by changing the purge time of the source gas or adjusting the internal pressure of the reactor in such a way as to ensure that the film forming rate at the inner portion of the pattern is greater than the film forming rate at the upper portion of the pattern.
摘要:
The present invention concerns a method of forming a chalcogenide thin film for a phase-change memory. In the method of forming a chalcogenide thin film according to the present invention, a substrate with a pattern formed is loaded into a reactor, and a source gas is supplied onto the substrate. Here, the source gas includes at least one source gas selected from germanium (Ge) source gas, gallium (Ga) source gas, indium (In) source gas, selenium (Se) source gas, antimony (Sb) source gas, tellurium (Te) source gas, tin (Sn) source gas, silver (Ag) source gas, and sulfur (S) source gas. A first purge gas is supplied onto the substrate in order to purge the source gas supplied onto the substrate, a reaction gas for reducing the source gas is then supplied onto the substrate, and a second purge gas is supplied onto the substrate in order to purge the reaction gas supplied onto the substrate. At least one operation, namely changing the supply time of the first purge gas and/or adjusting the internal pressure of the reactor is performed in such a way as to ensure that the deposition rate at an inner portion of the pattern is greater than the deposition rate at an upper portion of the pattern. According to the present invention, it is possible to form a chalcogenide thin film having an excellent gap-fill property by changing the purge time of the source gas or adjusting the internal pressure of the reactor in such a way as to ensure that the film forming rate at the inner portion of the pattern is greater than the film forming rate at the upper portion of the pattern.