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公开(公告)号:USD579823S1
公开(公告)日:2008-11-04
申请号:US29298814
申请日:2007-12-13
申请人: Young Choi , Roger Brown , Jason Pope , Jiro Ikeda , Chi Jung
设计人: Young Choi , Roger Brown , Jason Pope , Jiro Ikeda , Chi Jung
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公开(公告)号:USD613220S1
公开(公告)日:2010-04-06
申请号:US29298831
申请日:2007-12-13
申请人: Jiro Ikeda , Roger Brown
设计人: Jiro Ikeda , Roger Brown
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公开(公告)号:US08506774B2
公开(公告)日:2013-08-13
申请号:US11596872
申请日:2005-05-16
申请人: Jiro Ikeda , Yoji Takizawa
发明人: Jiro Ikeda , Yoji Takizawa
IPC分类号: C23C14/34
CPC分类号: G11B7/265 , C23C14/56 , C23C14/566 , C23C14/568
摘要: To provide a vacuum processing apparatus applicable to various manufacturing processes, by efficiently and highly reliably stacking films of various types and thicknesses and by downsizing the manufacturing apparatus by suppressing size increase of the apparatus due to increase of the number of film forming chambers caused by increase and complexity of process steps. A vacuum processing apparatus is provided with a plurality of film forming process parts which are provided with rotating transfer tables and film forming chambers. The rotating transfer tables form a transfer path for a work to be processed, in chambers which can be vacuum-exhausted. The film forming chambers are provided for depositing a film on the work to be processed which is arranged and transferred along a circumference which has a rotating shaft of the rotating transfer table as a center. The vacuum processing apparatus is also provided with a connecting part which connects the film forming process parts so as to share a vacuum space between the chambers, and the work to be processed in the film forming process parts is mutually transferred in the vacuum. A load lock mechanism is provided in one of the film forming process part or in the connecting part.
摘要翻译: 为了提供可应用于各种制造工艺的真空处理装置,通过有效且高度可靠地层叠各种类型和厚度的薄膜,并且通过抑制由于增加引起的成膜室数量的增加,装置的尺寸增加而缩小制造装置 和过程步骤的复杂性。 真空处理装置设置有多个成膜处理部件,其设置有旋转转印台和成膜室。 旋转传送台形成用于待加工的工件的传送路径,可在真空排气的室内。 成膜室被设置用于在沿着旋转转台的旋转轴的圆周为中心布置和移动的待加工工件上沉积薄膜。 真空处理装置还设置有连接部件,连接成膜处理部分以在腔室之间共享真空空间,并且成膜处理部件中待处理的工件在真空中相互转移。 在成膜处理部分或连接部分中的一个中设置有装载锁定机构。
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公开(公告)号:USD525915S1
公开(公告)日:2006-08-01
申请号:US29234348
申请日:2005-07-18
申请人: Motoaki Minowa , Jiro Ikeda
设计人: Motoaki Minowa , Jiro Ikeda
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公开(公告)号:US5254236A
公开(公告)日:1993-10-19
申请号:US767399
申请日:1991-09-30
申请人: Kyoji Kinokiri , Jiro Ikeda
发明人: Kyoji Kinokiri , Jiro Ikeda
CPC分类号: H01J37/3244 , C23C14/042 , C23C14/564
摘要: In a sputtering apparatus comprising a film-deposition chamber having a gas-supplying pipe connected thereto, for depositing a film on the surface of a substrate to be processed, a target provided in the film-deposition chamber, a mask having an opening portion and a masking portion, the mask being provided opposing to the target in the film-deposition chamber, and holding means for holding the substrate against the mask in such a manner that the film-depositing surface of the substrate is in close contact with the mask, the improvement according to the present invention comprises a mask having exhaust passages formed in the masking portion thereof, each of exhaust passages having one end exposed to the inside of the film-deposition chamber and the other end exposed to the outside of the film-deposition chamber, the one end of each of the exhaust passages and the other end thereof being communicated with each other, but not seen through each other.
摘要翻译: 在包括具有与其连接的供气管的成膜室的溅射装置中,用于在被处理基板的表面上沉积膜,设置在成膜室中的靶,具有开口部分的掩模和 掩模部分,所述掩模设置成与所述成膜室中的所述靶相对;以及保持装置,用于将所述基板保持在所述掩模上,使得所述基板的所述成膜表面与所述掩模紧密接触, 根据本发明的改进包括具有形成在其掩蔽部分中的排气通道的掩模,每个排气通道具有暴露于成膜室内部的一端和暴露于膜沉积物外侧的另一端 每个排气通道的一端和另一端彼此连通,但彼此不能看到。
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公开(公告)号:US5183547A
公开(公告)日:1993-02-02
申请号:US684919
申请日:1991-04-19
申请人: Jiro Ikeda
发明人: Jiro Ikeda
CPC分类号: C23C14/56
摘要: The present invention provides a sputtering apparatus employed for producing an optical disc, for example, wherein a material to be processed by sputtering, such as a disc base plate, is placed in a vacuum chamber having an opening for entrance and exit of the material and a sputtering station, and is transported between the opening and the sputtering station by a rotary arm or arms, in such a manner as to simplify and reduce the size of the vacuum chamber and increase the production quantity per unit time. The present invention also provides an arrangement in which at least two of the sputtering apparatus are arranged in juxtaposition, and the sputtering operation is performed by one of the apparatus during the time when the sputtering operation is completed and the next sputtering operation is not started in the remaining apparatus, so that the equipment common to the respective sputtering apparatus, such as the sputtering power source, may be used so as to simplify the apparatus and increase the production quantity per unit time.
摘要翻译: PCT No.PCT / JP90 / 01170 Sec。 371日期1991年04月19日 102(e)日期1991年4月19日PCT提交1990年9月12日PCT公布。 出版物WO91 / 04352 日本1991年04月4日。本发明提供了一种用于制造光盘的溅射装置,例如,其中将通过溅射处理的材料(例如盘基板)放置在具有开口的真空室中 材料的入口和出口以及溅射站,并且通过旋转臂或臂在开口和溅射站之间传送,以简化和减小真空室的尺寸并增加每单位的产量 时间。 本发明还提供了一种这样的布置,其中至少两个溅射装置并列布置,并且溅射操作由溅射操作完成之后的装置之一进行,并且下一个溅射操作没有开始 可以使用溅射电源等溅射装置共用的设备,以简化设备并增加每单位时间的生产量。
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公开(公告)号:US20080029023A1
公开(公告)日:2008-02-07
申请号:US11596872
申请日:2005-05-16
申请人: Jiro Ikeda , Yoji Takizawa
发明人: Jiro Ikeda , Yoji Takizawa
CPC分类号: G11B7/265 , C23C14/56 , C23C14/566 , C23C14/568
摘要: To provide a vacuum processing apparatus applicable to various manufacturing processes, by efficiently and highly reliably stacking films of various types and thicknesses and by downsizing the manufacturing apparatus by suppressing size increase of the apparatus due to increase of the number of film forming chambers caused by increase and complexity of process steps. A vacuum processing apparatus is provided with a plurality of film forming process parts which are provided with rotating transfer tables and film forming chambers. The rotating transfer tables form a transfer path for a work to be processed, in chambers which can be vacuum-exhausted. The film forming chambers are provided for depositing a film on the work to be processed which is arranged and transferred along a circumference which has a rotating shaft of the rotating transfer table as a center. The vacuum processing apparatus is also provided with a connecting part which connects the film forming process parts so as to share a vacuum space between the chambers, and the work to be processed in the film forming process parts is mutually transferred in the vacuum. A load lock mechanism is provided in one of the film forming process part or in the connecting part.
摘要翻译: 为了提供适用于各种制造工艺的真空处理装置,通过有效且高度可靠地层叠各种类型和厚度的薄膜,并且通过抑制由于增加引起的成膜室数量的增加而使装置的尺寸增加 和过程步骤的复杂性。 真空处理装置设置有多个成膜处理部件,其设置有旋转转印台和成膜室。 旋转传送台形成用于待加工的工件的传送路径,可在真空排气的室内。 成膜室被设置用于在沿着旋转转台的旋转轴的圆周为中心布置和移动的待加工工件上沉积薄膜。 真空处理装置还设置有连接部件,连接成膜处理部分以在腔室之间共享真空空间,并且成膜处理部件中待处理的工件在真空中相互转移。 在成膜处理部分或连接部分中的一个中设置有装载锁定机构。
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公开(公告)号:USD529209S1
公开(公告)日:2006-09-26
申请号:US29234351
申请日:2005-07-18
申请人: Jiro Ikeda
设计人: Jiro Ikeda
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公开(公告)号:US5336029A
公开(公告)日:1994-08-09
申请号:US757982
申请日:1991-09-12
申请人: Naoki Kato , Eiji Konoshima , Kyoji Kinokiri , Jiro Ikeda
发明人: Naoki Kato , Eiji Konoshima , Kyoji Kinokiri , Jiro Ikeda
CPC分类号: G11B7/26 , B65G47/914 , B65G47/918
摘要: A suction head having plural suction pads on both surfaces thereof is used to transfer a substrate of a compack disk and the like from one position to another for loading. The suction head is connected to a rotating shaft rotatable and movable in a vertical direction. The rotating shaft causes the suction head to turn over and move in an up-and-down direction. The suction pads on both surfaces of the suction head are connected to a pair of flexible pipes which are wound around the shaft and connected respectively to exhaust systems. Thus, the suction pads capture and release the substrate by suction control so as to load the same at a prescribed position. Further, a shock absorber is provided to relieve a shock upon the stoppage of the suction head in vertical and rotational reciprocating motions.
摘要翻译: 使用在其两个表面上具有多个吸盘的吸头将复合盘等的基板从一个位置传送到另一个位置用于装载。 吸头连接到可旋转并可在垂直方向上移动的旋转轴。 旋转轴使吸头翻转并沿上下方向移动。 吸头两面的吸盘连接在一对挠性管上,这些柔性管缠绕在轴上并分别连接到排气系统上。 因此,吸盘通过抽吸控制来捕获和释放基板,以将其装载到规定位置。 此外,提供减震器以减轻在垂直和旋转往复运动中吸头停止的冲击。
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公开(公告)号:US5324087A
公开(公告)日:1994-06-28
申请号:US15888
申请日:1993-02-10
申请人: Yuichiro Shimose , Jiro Ikeda
发明人: Yuichiro Shimose , Jiro Ikeda
IPC分类号: B65G43/08 , B25J15/06 , B65G47/91 , B65G49/07 , B65H3/08 , B65H7/16 , B66C1/02 , G11B7/26 , H01L21/66 , H01L21/677 , H01L21/683 , B66K1/02
CPC分类号: H01L21/6838 , B65G47/91 , Y10S294/907
摘要: A sucked substrate detecting apparatus is provided which comprises sucking pads for sucking disk substrates, a main pipe connected to the sucking pads, a vacuum pump connected through a first valve to the main pipe, first and second branch pipes connected respectively to the main pipe, a second valve connected to the first branch pipe, for opening and closing with respect to the atmosphere, a pressure sensor connected to the second branch pipe, for substantially detecting the pressure in the main pipe, and a controller connected to the first and second valves. The sucked substrate detecting apparatus can judge on the basis of the output levels produced from the pressure sensor, the presence or absence of a disk substrate sucked by the sucking pads and whether or not the disk substrate has been satisfactorily sucked by the sucking pads.
摘要翻译: 本发明提供一种吸附基板检测装置,其特征在于,包括:用于吸取盘基板的吸盘,与吸盘连接的主管,通过第一阀连接到主管的真空泵,分别与主管连接的第一和第二分支管, 连接到第一分支管的第二阀,用于相对于大气打开和关闭;连接到第二分支管的压力传感器,用于基本上检测主管中的压力;以及控制器,连接到第一和第二阀 。 被吸取的基板检测装置可以基于从压力传感器产生的输出电平,由吸盘吸附的盘基板的存在或不存在以及盘基板是否被吸盘令人满意地吸住来进行判断。
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