公开(公告)号：US20090242125A1

公开(公告)日：2009-10-01

申请号：US12409371

申请日：2009-03-23

申请人： Young J. Paik ,  Melvin Barrentine ,  Abhijit Y. Desai ,  Hai Nguyen ,  Ashish Bhatnagar ,  Rajkumar Alagarsamy

发明人： Young J. Paik ,  Melvin Barrentine ,  Abhijit Y. Desai ,  Hai Nguyen ,  Ashish Bhatnagar ,  Rajkumar Alagarsamy

IPC分类号： C23F1/08 ,  C09K3/14 ,  F16J15/02 ,  B32B3/00 ,  B32B3/02

CPC分类号： H01L21/6838 ,  B24B37/30 ,  H01L21/0201 ,  H01L21/30625 ,  Y10T428/24355 ,  Y10T428/24612

摘要： A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.

摘要翻译： 提供了一种用于平坦化基板的方法和装置。 提供了一种具有改进的用于固定基板的盖的基板载体头。 盖可以具有比其配合的凹部大的凸缘，使得压缩在凹部内形成共形密封。 胎圈也可以不涂覆以增强胎圈与沟槽表面的粘附。 盖的表面可以被粗糙化，以减少基材与盖的粘附，而不使用不粘涂层。