公开(公告)号：US07438563B2

公开(公告)日：2008-10-21

申请号：US11295208

申请日：2005-12-05

申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

IPC分类号： H01R4/58

CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件和在高密度导电硅树脂部件下方基本上垂直取向形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

公开(公告)号：US20060121757A1

公开(公告)日：2006-06-08

申请号：US11295208

申请日：2005-12-05

申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

IPC分类号： H01R4/58

CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件，以及在高密度导电硅树脂部件下方大致垂直取向地形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。