公开(公告)号：US20060121757A1

公开(公告)日：2006-06-08

申请号：US11295208

申请日：2005-12-05

申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

IPC分类号： H01R4/58

CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件，以及在高密度导电硅树脂部件下方大致垂直取向地形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

公开(公告)号：US07438563B2

公开(公告)日：2008-10-21

申请号：US11295208

申请日：2005-12-05

申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

IPC分类号： H01R4/58

CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件和在高密度导电硅树脂部件下方基本上垂直取向形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

公开(公告)号：US20080180124A1

公开(公告)日：2008-07-31

申请号：US12019642

申请日：2008-01-25

申请人： Young Bae Chung

发明人： Young Bae Chung

IPC分类号： G01R31/26

CPC分类号： G01R1/0458

摘要： Provided is a cooling apparatus for a semiconductor device. The apparatus includes: a main body capable of moving vertically to face the semiconductor device that is mounted on a test unit in order to perform an electrical test; a heat exchange unit combined with the main body and contacting a top surface of the semiconductor device to absorb heat generated by the semiconductor device; and a lift unit combined with the main body and for moving the main body vertically. The heat exchange unit is combined with the main body to be capable of rotating according to an angle by which the semiconductor device is tilted when the heat exchange unit contacts the semiconductor device.

摘要翻译： 本发明提供一种半导体装置的冷却装置。 该装置包括：能够垂直移动以面对安装在测试单元上的半导体器件以进行电测试的主体; 与主体结合并与半导体器件的顶表面接触以吸收由半导体器件产生的热量的热交换单元; 以及与主体结合并用于垂直移动主体的提升单元。 所述热交换单元与所述主体组合，以便当所述热交换单元接触所述半导体器件时，所述主体能够根据所述半导体器件倾斜的角度旋转。