公开(公告)号：US06943577B2

公开(公告)日：2005-09-13

申请号：US10677743

申请日：2003-10-01

申请人： Young-Gu Shin ,  Kyoung-Il Heo ,  Hyoung-Young Lee ,  Hyuk Kwon ,  Ki-Bong Ju ,  Jeong-Ho Bang ,  Hyun-Seop Shim

发明人： Young-Gu Shin ,  Kyoung-Il Heo ,  Hyoung-Young Lee ,  Hyuk Kwon ,  Ki-Bong Ju ,  Jeong-Ho Bang ,  Hyun-Seop Shim

IPC分类号： G01R31/28 ,  G01R31/26 ,  G01R31/3185

CPC分类号： G01R31/318505 ,  G01R31/318513

摘要： A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.

摘要翻译： 一种用于测试包括多个半导体芯片的多芯片封装的测试装置，其包括具有一个驱动通道和至少一个输入/输出通道的测试驱动器。 测试板安装有多芯片封装。 半导体芯片的驱动引脚并联连接到驱动通道，并且半导体芯片的输入/输出引脚并联连接到输入/输出通道。

公开(公告)号：US07327154B2

公开(公告)日：2008-02-05

申请号：US11191494

申请日：2005-07-27

申请人： Young-Gu Shin ,  Kyoung-Il Heo ,  Hyoung-Young Lee ,  Hyuk Kwon ,  Ki-Bong Ju ,  Jeong-Ho Bang ,  Hyun-Seop Shim

发明人： Young-Gu Shin ,  Kyoung-Il Heo ,  Hyoung-Young Lee ,  Hyuk Kwon ,  Ki-Bong Ju ,  Jeong-Ho Bang ,  Hyun-Seop Shim

IPC分类号： G01R31/28

CPC分类号： G01R31/318505 ,  G01R31/318513

摘要： A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.

摘要翻译： 一种用于测试包括多个半导体芯片的多芯片封装的测试装置，其包括具有一个驱动通道和至少一个输入/输出通道的测试驱动器。 测试板安装有多芯片封装。 半导体芯片的驱动引脚并联连接到驱动通道，并且半导体芯片的输入/输出引脚并联连接到输入/输出通道。

公开(公告)号：US20050258858A1

公开(公告)日：2005-11-24

申请号：US11191494

申请日：2005-07-27

申请人： Young-Gu Shin ,  Kyoung-Il Heo ,  Hyoung-Young Lee ,  Hyuk Kwon ,  Ki-Bong Ju ,  Jeong-Ho Bang ,  Hyun-Seop Shim

发明人： Young-Gu Shin ,  Kyoung-Il Heo ,  Hyoung-Young Lee ,  Hyuk Kwon ,  Ki-Bong Ju ,  Jeong-Ho Bang ,  Hyun-Seop Shim

IPC分类号： G01R31/28 ,  G01R31/26 ,  G01R31/3185

CPC分类号： G01R31/318505 ,  G01R31/318513

摘要： A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.