公开(公告)号：US08198722B2

公开(公告)日：2012-06-12

申请号：US12580306

申请日：2009-10-16

申请人： Youngsang Cho ,  Donghan Kim ,  Daewoo Son ,  Kyoungsei Choi ,  Yechung Chung

发明人： Youngsang Cho ,  Donghan Kim ,  Daewoo Son ,  Kyoungsei Choi ,  Yechung Chung

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/50 ,  H01L23/49838 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor package has an interconnection substrate including a first conductive lead and a second longer conductive lead, and a semiconductor chip including a first cell region, a second cell region, a first conductive pad electrically connected to the first cell region and a second conductive pad electrically connected to the second cell region. The semiconductor chip is mounted to the interconnection substrate with the first and second conductive pads both disposed on and connected to the second conductive lead.

摘要翻译： 半导体封装具有包括第一导电引线和第二较长导电引线的互连基板，以及包括第一单元区域，第二单元区域，电连接到第一单元区域的第一导电焊盘和第二导电焊盘的半导体芯片 电连接到第二单元区域。 半导体芯片安装到互连基板上，其中第一和第二导电焊盘都设置在第二导电引线上并连接到第二导电引线。