公开(公告)号：US20090190311A1

公开(公告)日：2009-07-30

申请号：US12019218

申请日：2008-01-24

Applicant: Yu-kang Peng

Inventor： Yu-kang Peng

IPC: H05K7/02 ,  G06F1/16 ,  H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic element packaging is provided, the unit is formed with a colloid layer in a predetermined shape, and a chipset is adhered and mounted inside the colloid layer and comprises a predetermined chip and a conductor so that the unit is packaged without any substrate, thereby the costs of substrate use and design being decreased when the unit is fabricated. No consideration of the difference of heat expansion coefficient of the chip from that of substrate is made, thereby the reliability being increased and the service life being prolonged.

Abstract translation: 提供电子元件封装，该单元形成有预定形状的胶体层，并且将芯片组粘附并安装在胶体层内，并且包括预定的芯片和导体，使得该单元被封装而没有任何基板，从而 当制造单元时，衬底使用和设计的成本降低。 不考虑芯片的热膨胀系数与基板的热膨胀系数的差异，从而提高可靠性并延长使用寿命。