公开(公告)号：US20150364214A1

公开(公告)日：2015-12-17

申请号：US14760615

申请日：2013-01-15

申请人： Yueping LI ,  MICRON TECHNOLOGY, INC.

发明人： Yueping Li

IPC分类号： G11C29/04 ,  H01L23/525 ,  H01L25/065 ,  G11C5/04 ,  G11C29/44 ,  H01L21/66

CPC分类号： G11C29/04 ,  G11C5/04 ,  G11C29/44 ,  G11C2029/0401 ,  G11C2029/4402 ,  H01L22/14 ,  H01L22/20 ,  H01L22/22 ,  H01L23/5256 ,  H01L23/544 ,  H01L24/98 ,  H01L25/0657 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2224/16225 ,  H01L2924/19107

摘要： Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.

摘要翻译： 本文公开了可回收半导体器件封装和组件的几个实施例。 半导体器件组件（100）包括具有壳体（102）和布置成接收指示回收状态的信号的封装触头（104）的封装（101）。 半导体管芯（106）的多个模块位于壳体内并电耦合到封装触点（104）。 第一模块和第二模块的模具（106）被配置为存储模块配置状态。 第一和第二模块（107a，107b）至少部分地基于回收状态和模块配置状态而被启用以进行操作。

公开(公告)号：US09875808B2

公开(公告)日：2018-01-23

申请号：US14760615

申请日：2013-01-15

申请人： Yueping Li

发明人： Yueping Li

IPC分类号： G11C5/02 ,  G11C29/04 ,  H01L23/544 ,  G11C29/44 ,  H01L25/065 ,  G11C5/04 ,  H01L23/525 ,  H01L23/00 ,  H01L21/66

CPC分类号： G11C29/04 ,  G11C5/04 ,  G11C29/44 ,  G11C2029/0401 ,  G11C2029/4402 ,  H01L22/14 ,  H01L22/20 ,  H01L22/22 ,  H01L23/5256 ,  H01L23/544 ,  H01L24/98 ,  H01L25/0657 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2224/16225 ,  H01L2924/19107

摘要： Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.

公开(公告)号：US20200051657A1

公开(公告)日：2020-02-13

申请号：US16653994

申请日：2019-10-15

申请人： Micron Technology, Inc.

发明人： Yueping Li

IPC分类号： G11C29/04 ,  H01L23/544 ,  G11C29/44 ,  H01L25/065 ,  G11C5/04 ,  H01L21/66 ,  H01L23/525

摘要： Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.

公开(公告)号：US11854635B2

公开(公告)日：2023-12-26

申请号：US16653994

申请日：2019-10-15

申请人： Micron Technology, Inc.

发明人： Yueping Li

IPC分类号： G11C29/04 ,  G11C29/44 ,  G11C5/04 ,  H01L23/544 ,  H01L25/065 ,  H01L21/66 ,  H01L23/525 ,  H01L23/00

CPC分类号： G11C29/04 ,  G11C5/04 ,  G11C29/44 ,  H01L22/22 ,  H01L23/5256 ,  H01L23/544 ,  H01L25/0657 ,  G11C2029/0401 ,  G11C2029/4402 ,  H01L22/14 ,  H01L22/20 ,  H01L24/98 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2224/16225 ,  H01L2924/19107

摘要： Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.

公开(公告)号：US10482988B2

公开(公告)日：2019-11-19

申请号：US15815521

申请日：2017-11-16

申请人： Micron Technology, Inc.

发明人： Yueping Li

IPC分类号： G11C29/04 ,  H01L23/544 ,  G11C29/44 ,  H01L25/065 ,  G11C5/04 ,  H01L21/66 ,  H01L23/525 ,  H01L23/00

摘要： Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.

公开(公告)号：US20180090223A1

公开(公告)日：2018-03-29

申请号：US15815521

申请日：2017-11-16

申请人： Micron Technology, Inc.

发明人： Yueping Li

IPC分类号： G11C29/04 ,  H01L23/525 ,  G11C29/44 ,  H01L21/66 ,  G11C5/04 ,  H01L23/544 ,  H01L25/065 ,  H01L23/00

CPC分类号： G11C29/04 ,  G11C5/04 ,  G11C29/44 ,  G11C2029/0401 ,  G11C2029/4402 ,  H01L22/14 ,  H01L22/20 ,  H01L22/22 ,  H01L23/5256 ,  H01L23/544 ,  H01L24/98 ,  H01L25/0657 ,  H01L2223/5444 ,  H01L2223/54473 ,  H01L2224/16225 ,  H01L2924/19107

摘要： Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.