公开(公告)号：US08354295B2

公开(公告)日：2013-01-15

申请号：US13275935

申请日：2011-10-18

申请人： Yuer-Luen Tu ,  Chia-Shiung Tsai ,  Ching-Chun Wang ,  Ren-Jie Lin ,  Shou-Gwo Wuu

发明人： Yuer-Luen Tu ,  Chia-Shiung Tsai ,  Ching-Chun Wang ,  Ren-Jie Lin ,  Shou-Gwo Wuu

IPC分类号： H01L21/00

CPC分类号： H01L27/14609 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643

摘要： The present disclosure provides methods and apparatus for reducing dark current in a backside illuminated semiconductor device. In one embodiment, a method of fabricating a semiconductor device includes providing a substrate having a frontside surface and a backside surface, and forming a plurality of sensor elements in the substrate, each of the plurality of sensor elements configured to receive light directed towards the backside surface. The method further includes forming a dielectric layer on the backside surface of the substrate, wherein the dielectric layer is formed to have a compressive stress to induce a tensile stress in the substrate. A backside illuminated semiconductor device fabricated by such a method is also disclosed.

摘要翻译： 本公开提供了用于减少背面照明半导体器件中的暗电流的方法和装置。 在一个实施例中，制造半导体器件的方法包括提供具有前表面和背面的衬底，以及在衬底中形成多个传感器元件，所述多个传感器元件中的每一个被配置为接收朝向背面的光 表面。 该方法还包括在衬底的背面形成电介质层，其中介电层形成为具有压应力以在衬底中引起拉伸应力。 还公开了通过这种方法制造的背面照明半导体器件。